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Manufacturer Part #
R5F51306BDFM#30
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160 per Tray
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Description of Change:Addition of Wafer fabrication site: Renesas Semiconductor Manufacturing Co., Ltd. (Naka Factory).Reason for Change:For stable supplyIdentification: Identifiable thru production history data via trace code or packing label
Description of Change:Die-bonding and resin materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd).Reason for Change:The new materials are already proven and used for other products in RSB assembly.No samples planned because the changed materials are already well known and used in mass production for other products.To ensure stable supply
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
