Manufacturer Part #
ProASIC3 Series 250000 System Gate 68 I/O 1.575 V Surface Mount FPGA -VQFP-100
Microchip A3P250-VQG100 - Product Specification
Description of Change:Implement Microchip Part Aging Policy, Recertification and Combination rules, Labels and Packing Changes for selected Microsemi Field Programmable Gate Array (FPGA) and Mixed Signal and ASIC(MSA) products.Pre Change: Using Microsemi�s packing processPost Change:Using Microchip�s packing processPre and Post Change Summary:NOTE: See attached Packing Pre and Post Changes for the changes Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated Implementation Date: February 15, 2021 (date code: 2108)Note: The earliest implementation date is the earliest date that we may implement any combination of the changes listed in this PCN as we will not implement any of the proposed changes prior to this date. After the earliest implementation date these changes may occur to any product over the course of many months depending on inventory levels and business conditions.Time Table Summary: see attachedRevision History:January 18, 2021: Issued final notification. Provided estimated first ship date to be on February 15, 2021.The change described in this PCN does not alter Microchip�s current regulatory compliance regarding the material content of the applicable products.
Description of Change: Implement Microchip Top marking changes for selected Microsemi Field-Programmable Gate Arrays (FPGAs) products available in various packages.Pre Change: Microsemi top marking format and traceability codePost Change: Microchip top marking format and traceability codePre and Post Change Summary: see attachedImpacts to Data Sheet: Where applicableChange Impact: NoneReason for Change:To improve manufacturability and traceability by standardizing marking format for selected Microsemi products as part of the integration of Microchip and Microsemi.Change Implementation Status: In ProgressEarliest Implementation Date: March 1, 2021 (Date code: 2110)Note: The earliest implementation date is the earliest date that we may implement any combination of the changes listed in this PCN as we will not implement any of the proposed changes prior to this date. After the earliest implementation date these changes may occur to any product over the course of many months depending on inventory levels and businessconditions.Time Table Summary:
DescriptionMicrosemi SoC will add Microchip Technology Thailand (MMT) for the assembly support for commercial/industrial/automotive/military-grade ProASIC3 and IGLOO devices in VQ100 and VQG100 packages.Reason for ChangeAdditional assembly support needed for assembly of ProASIC3 and IGLOO devices in VQ100 and VQG100.Microsemi SoC is currently qualifying MMT for the assembly of VQ/G100 devices with expected qualification completion by September 15, 2020.