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Manufacturer Part #
MCP3909-I/SS
MCP3909 Series 5.5 V Energy Metering IC with SPI Interface - SSOP-24
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:59 per Tube Package Style:SSOP-24 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP3909-I/SS - Product Specification
Shipping Information:
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PCN Information:
*** Update for PCN 112912 ***Revision History: March 07, 2025: Issued initial notification.March 10, 2025: Re-issued initial notification to update the Qualification Plan file.May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.November 11, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 10, 2025. Updated affected parts list to add MCP1824ST1202E/DBVAO, MCP1824T1802E/OTVAO, MCP1825S-5002E/DBVAO and MCP1725-5002E/SNVAO catalog part numbers (CPN). Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families of 132k and 133k technologies available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 10 December 2025 (date code: 2550)
******FPCN111387 UPDATE/LOCATION CHANGE******Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.**March 10, 2025: Re-issued initial notification to update the Qualification Plan file.**May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP3909-I/SS&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--semi-energy--analog-front-end/mcp3909-i-ss-microchip-1028836
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP3909-I/SS&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--semi-energy--analog-front-end/mcp3909-i-ss-microchip-1028836
Microchip MCP3909-I/SS - Technical Attributes
| Wh Accuracy: | 0.1% |
| Dynamic Range: | 1dB to 1000dB |
| Interface: | SPI |
| Package Style: | SSOP-24 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP3909 is an energy measurement IC supporting the IEC 62053 international energy metering specification. The output of the device includes a frequency proportional to the average active (real) power at the inputs as well as a simultaneous serial SPI interface to access the ADC channels and multiplier output data.
The MCP3909 incorporates two 16-bit delta-sigma ADCs with a progammable gain up to 16, which enable small shunt meter designs for measuring a wide range of Ib and Imax currents. The output waveform data is available at up to 14 kHz with 16-bit ADC output and 20-bit multiplier output data. The integrated on-chip voltage reference has an ultra-low temperature drift of 15 ppm per degree C.
Features:
- Supplies active (real) power measurement for single-phase, residential energy metering
- Supports IEC 62053 International Energy Metering Specification and legacy IEC 1036/61036/687 Specifications
- Two multi-bit, DAC, second-order, 16-bit, Delta-Sigma Analog-to-Digital Converters (ADCs)
- Ultra-low drift on-chip reference: 15 ppm/°C (typ.)
- Low IDD of 4 mA (typ.)
- Active power pulse output
- SPI™ interface for access to raw ADC and multiplier data
View the complete product family of MCP390x series Energy Metering IC
Available Packaging
Package Qty:
59 per Tube
Package Style:
SSOP-24
Mounting Method:
Surface Mount