Manufacturer Part #
3-5353652-6
440 Position 0.5 mm Pitch Outer Shroud Contacts SMT Vertical Board to Board Plug
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| Mfr. Name: | TE Connectivity | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:54 per Tray | ||||||||||
| Date Code: | 2229 | ||||||||||
TE Connectivity 3-5353652-6 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of ChangesManufacturing location change. Following Part Numbers will be transferred from TE leased site in Qingdao high tech zone to TE main campus in Qingdao for Data and Devices business unit. Qingdao high tech zone also run by TE production under TE quality control system. Operator/Tooling/Process is not changed and just manufacturing location change. Reason for Changes:To streamline TE s operating efficiencies and align manufacturing resources based on our internal footprint evaluation.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=Asia&field16=en&field2=3-5353652-6&field4=TE Connectivity&field18=https://p1apac.futureelectronics.com/p/interconnect--dual-in-line-package-sockets/3-5353652-6-te-connectivity-9959933
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=Asia&field16=en&field2=3-5353652-6&field4=TE Connectivity&field18=https://p1apac.futureelectronics.com/p/interconnect--dual-in-line-package-sockets/3-5353652-6-te-connectivity-9959933
Features & Applications
The 3-5353652-6 is a two-piece connector with 0.5mm Free Height system, designed for parallel board-to-board stacking applications.
Product Features:
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 440 Positions
- In-Line Contact Layout
- PCB Mounting Orientation = Vertical
- Sealant = Without
- Industry Application = Board-to-Board (Personal Systems/Computers), Mezzanine/Stacking (Multi-User), MFP/LBP, Inkjet, Networking (Communications), TESTANDMEASURE, TMBoard2Board
- Family Name = Free Height
- Contact Layout = In-Line
- Contact Base Material = Copper Alloy
- Contact Plating, Mating Area, Material = Gold (8)
- Lead Free Solder Processes = Reflow solder capable to 245°C
Available Packaging
Package Qty:
54 per Tray