Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
SCT3060ALGC11
Download the CAD models for this product. Learn more about SnapMagic.
30 per Tube
TO-247-3
Through Hole
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Detailed description of change:Now: *On-board SiC chip's wafer diameter: 4inch - Front-end manufacturing plants : - ROHM Apollo Co., Ltd. Chikugo Plant After:*On-board SiC chip's wafer diameter: 6inch - Front-end manufacturing plants : - Lapis Semiconductor Co., Ltd. Miyazaki Plant Reason:To expand production capacity.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
Total system solutions in the industrial power sector by ROHM, ha...