Manufacturer Part #
SY89843UMG
PRECISION 2:1 LVPECL RPE & FSI MUX W/ 1:2 FANOUT
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:75 per Tube Package Style:QFN-24 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2246 | ||||||||||
Microchip SY89843UMG - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
Microchip SY89843UMG - Technical Attributes
| Type: | Multiplexer |
| Configuration: | 1 x 2:1 |
| No of Channels: | 2 |
| Supply Voltage: | 2.375V to 3.6V |
| Package Style: | QFN-24 |
| Mounting Method: | Surface Mount |
Features & Applications
The SY89843UMG is a low jitter PECL, 2:1 differential input multiplexer (MUX) optimized for redundant source switchover applications.
The SY89843U unique 2:1 Runt Pulse Eliminator (RPE) MUX prevents any short cycles or “runt” pulses during switchover. In addition, a unique Fail-Safe Input protection prvents metastable conditions when the selected input clock fails to a DC voltage
Features:
- Selects between two sources, and provides a glitch-free,stable LVPECL output
- Guaranteed AC performance over temperature and supply voltage:
- – Wide operating frequency: 1k Hz to >1.5 GHz
- – < 880 ps In-to-Out tpd
- – < 190 ps tr/tf
- Unique patent-pending input isolation design minimizes crosstalk
- Fail-Safe Input prevents oscillations
- Ultra-low jitter design:
- – <1psRMS random jitter
- – <1psRMS cycle-to-cycle jitter
- – <10psPP total jitter (clock)
- – <0.7psRMS MUX crosstalk induced jitter
- 800 mV LVPECL output swing
- 2.5 V ±5% or 3.3 V ±10% supply voltage
- –40°C to +85°C industrial temperature range
- Available in 24-pin (4mm x 4mm) MLF Package
Applications:
- Redundant clock switchover
- Failsafe clock protection
Available Packaging
Package Qty:
75 per Tube
Package Style:
QFN-24
Mounting Method:
Surface Mount