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Manufacturer Part #
ATECC108A-MAHDA-T
ATECC108A Series 2 to 5.5 V 1 MHz Atmel CryptoAuthentication Device - UDFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:15000 per Reel Package Style:UDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATECC108A-MAHDA-T - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Revision History:December 28, 2021: Issued initial notification.August 4, 2022: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 25, 2022. Updated subject, description and pre and post change summary table to change A194 as an additional lead frame material. Updated affected CPN list to include catalog part numbers (CPN) released prior issuance of the Final PCN.Description of Change:Qualification of A194 as an additional lead frame material for selected Atmel products available in 8L UDFN (2x3x0.6mm) package at MMT assembly site.Reason for Change:To improve productivity by qualifying A194 as an additional lead frame material at MMT assembly site.
Part Status:
Microchip ATECC108A-MAHDA-T - Technical Attributes
| Memory Density: | 10kb |
| Supply Voltage-Nom: | 2V to 5.5V |
| Supply Current: | 3mA |
| Clock Frequency-Max: | 1MHz |
| Data Retention: | 10 yr |
| Interface Type: | I2C |
| Access Time-Max: | 550ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Package Style: | UDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
15000 per Reel
Package Style:
UDFN-8
Mounting Method:
Surface Mount