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Manufacturer Part #
PIC16F648AT-I/SO
Download the CAD models for this product. Learn more about SnapMagic.
1100 per Reel
SOIC-18
Surface Mount
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Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
The PIC16F648AT-I/SO is part of PIC16F mid-range family with a 8-Bit Microcontroller. It can sustain standard temperature ranges from -40°C to +125°C and has 18 pin in SOIC package. This device is lead free.
This powerful (200 nanosecond instruction execution) yet easy-to-program (only 35 single word instructions) CMOS FLASH-based 8-bit microcontroller packs Microchip's powerful PIC® architecture into an 18-pin package and is upwards compatible with the PIC16F628, PIC16C62XA, PIC16C5X and PIC12CXXX devices.
The PIC16F648A features 4 MHz internal oscillator, 256 bytes of EEPROM data memory, a capture/compare/PWM, a USART, 2 Comparators and a programmable voltage reference that make it ideal for analog/integrated level applications in automotive, industrial, appliances and consumer applications.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.