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Référence fabricant
CYT2B95BACQ0AZSGS
Auto MCU, Auto MCU
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :900 par Tray Style d'emballage :LQFP-100 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Infineon CYT2B95BACQ0AZSGS - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Detailed change information:Subject: Errata update affecting TRAVEO products.Reason:Update of Errata sheets to include:? TVII RTC Busy Status bit stuck issue? Ethernet RGMII external mode issue? ARM Errata for CM7 r1p1 - impact analysis for affected chips? Cortex M4 IP Errata for Traveo-II (TVII-B-E-1M / CYT2B7) chip
Detailed change informationReason/Motivation:Expansion of final test to assure continuity of supply and enable flexible manufacturing. Data sheet change due to update of specification.DescriptionDATA SHEET: Change of data sheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specificationTEST FLOW: Move of all or part of electrical wafer test and/or final test to a different test site.Intended start of delivery [1] : 2026-03-02Last order date (LOD) [2] : 2026-03-02Last delivery date (LDD) [3] : 2026-09-01
Detailed change informationSubject Update of Technical Reference Manual (TRM) affecting dedicated Traveo and PSoC productsDescription Old - Not applicableNew- PSoC 4 HVMS 128K TRM- Traveo II Body TRMReason:First version of TRM in MyICP, to consolidate the Traveo documentation migration in Legacy Infineon document database
Description:*Die attach material change*Change of mold compound / encapsulation material*Change of product marking*Move all or parts of production to a different assembly site*Change of carrier (tray, reel)*Move of all or part of electrical wafer test and/or final test to a different test siteReason:Capacity expansion of BE assembly to Advanced Semiconductor Engineering, Inc., Kaohsiung, Taiwan (ASE) to assure continuity of supply and enable flexible
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=CYT2B95BACQ0AZSGS&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--microcontrollers--32-bit/cyt2b95bacq0azsgs-infineon-C816412729
Infineon CYT2B95BACQ0AZSGS - Caractéristiques techniques
| Family Name: | TRAVEO T2G |
| Core Processor: | ARM Cortex M0 |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 2.0625MB |
| RAM Size: | 256kB |
| Speed: | 160MHz |
| No of I/O Lines: | 78 |
| InterfaceType / Connectivity: | I2C/SPI/UART |
| Peripherals: | Brownout Reset/Brown-out Detect/LVD/POR |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +105°C |
| On-Chip ADC: | 57chx12-bit |
| Style d'emballage : | LQFP-100 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
900 par Tray
Style d'emballage :
LQFP-100
Méthode de montage :
Surface Mount