
Manufacturer Part #
PIC24FJ64GA002-I/ML
PIC24F Series 8 kB RAM 64 kB Flash 16-Bit Microcontroller - QFN-28
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Mfr. Name: | Microchip | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:61 per Tube Package Style:QFN-28 Mounting Method:Surface Mount | ||||||||||
Date Code: | 1837 |
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 28L QFN (6x6x0.9mm) package at NSEB assembly site.Pre Change: Using gold (Au) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wire.Reason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:January 20, 2019 (date code: 1903)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 28L QFN-S, 64L, 44L and 28L QFN packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu).Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated First Ship Date:July 25, 2018(date code: 1830)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site Estimated First Ship Date:June 24, 2018 (date code:1826)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages..Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:April 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages.Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 64L,28L QFN-S, 44L and 28L packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu). Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated Qualification Completion Date: April 2018
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Product Lifecycle:
Technical Attributes
Family Name: | PIC24F |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 64kB |
RAM Size: | 8kB |
Speed: | 32MHz |
No of I/O Lines: | 21 |
InterfaceType / Connectivity: | I2C/SPI/UART |
Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/UART/Watchdog |
Number Of Timers: | 5 |
Supply Voltage: | 2V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 10-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | QFN-28 |
Mounting Method: | Surface Mount |
Features & Applications
PIC24FJ64GA002-I/ML is part of the PIC24F Series family with a 64K-Bit Flash Microcontroller.It can sustain standard temperature ranges from -40 to 125 and has 28 pin in a QFN package. This device is lead free.
Features:
- CPU:
- Up to 16 MIPS performance.
- 16 x 16 Hardware Multiply, Single Cycle Execution.
- 32-bit x 16-bit Hardware.
- Divider C Compiler Optimized Instruction Set.
- System:
- Internal oscillator support - 31 kHz to 8 MHz, up to 32 MHz with 4X PLL.
- On-chip LDO Voltage Regulator.
- JTAG Boundary Scan and Flash Memory Program Support.
- Fail-Safe Clock Monitor – allows safe shutdown if clock fails.
- Watchdog Timer with separate RC oscillator.
- nanoWatt Power Managed Modes:
- Run, Idle and Sleep modes.
- Multiple, Switchable Clock Modes for Optimum Performance and Power Management.
- Analog Features:
- 10-bit ADC, 10 channels, 500k samples per second.
- Two Analog comparators
Available Packaging
Package Qty:
61 per Tube
Package Style:
QFN-28
Mounting Method:
Surface Mount