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ATSAML10E14A-MF
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490 par Tray
VQFN-32
Surface Mount
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ECCN:
Informations PCN:
*** Update for PCN 111567 ***Revision History: March 12, 2025: Issued initial notification.February 04, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on May 07, 2026. Updated the notification subject. Revised affected parts list to add automotive part numbers. Description of Change: Qualification of UMC Fab 8S (U08S) an additional fabrication site for selected ATMPS001D14A, ATSAMD09C1x, ATSAMD09Dxx, ATSAMD10C1x, ATSAMD10D1x, ATSAMD11C14, ATSAMD11D14, ATSAMD20E1x, ATSAMD20G1x, ATSAMD20J1x, ATSAMD21E1x, ATSAMD21G1x, ATSAMD21J1x, ATSAMDA1E1x, ATSAMDA1G1x, ATSAMDA1J1x, ATSAML10D1xx, ATSAML10E1xx, ATSAML11D1xx, ATSAML11E1xx, ATSAML21E1xx, ATSAML21G1xx, ATSAML21J1xx, ATSAML22G1xx, ATSAML22J1xx, ATSAML22N1xx, PD39210, PD69210, PD69220, PD77010, PD77020, PIC32CM1602GV000xx, PIC32CM2532LE000xx, PIC32CM2532LS000xx, PIC32CM3204GV000xx, PIC32CM5164LE000xx, PIC32CM5164LS000xx, PIC32CM2532LE00100, PIC32CM2532LS00100, PIC32CM5164LE00100 and PIC32CM5164LS00100 device families available in various packages.Reason for Change: To improve productivity and on-time delivery performance by qualifying UMC Fab 8S (U08S) as an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date: 07 May 2026 (date code: 2619)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire for selected ATSAMC20E1, ATSAMC20G1, ATSAMC21E1, ATSAMC21G1, ATSAMD20E1, ATSAMD20G1, ATSAMD21E1, ATSAMD21G1, ATSAML10E1, ATSAML11E1, ATSAML21E1, ATSAML21G1, ATSAML22G1, PD39210, PD69210, PD77010, PD77020, PIC32CM1216MC00048, and PIC32CM6408MC00048 device families available various packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status: In ProgressEstimated First Ship Date: 04 March 2026 (date code: 2610)
*** Update for PCN 115821 ***Revision History: September 10, 2025: Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 31, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMD20E14, ATSAMC20E15A, ATSAMC20E16A, ATSAMC20E17A, ATSAMC20E18A, ATSAMC21E15A, ATSAMC21E16A, ATSAMC21E17A, ATSAMC21E18A, ATSAMD20E15, ATSAMD20E16, ATSAMD20E17, ATSAMD20E18, ATSAMD21E15, ATSAMD21E15L, ATSAMD21E16, ATSAMD21E16L, ATSAMD21E17, ATSAMD21E17L, ATSAMD21E18, ATSAML10E14A, ATSAML10E15A, ATSAML10E16A, ATSAML11E14A, ATSAML11E15A and ATSAML11E16A device families available in 32L VQFN (5x5x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 31 October 2025 (date code: 2544)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMD20E14, ATSAMC20E15A, ATSAMC20E16A, ATSAMC20E17A, ATSAMC20E18A, ATSAMC21E15A, ATSAMC21E16A, ATSAMC21E17A, ATSAMC21E18A, ATSAMD20E15, ATSAMD20E16, ATSAMD20E17, ATSAMD20E18, ATSAMD21E15, ATSAMD21E15L, ATSAMD21E16, ATSAMD21E16L, ATSAMD21E17, ATSAMD21E17L, ATSAMD21E18, ATSAML10E14A, ATSAML10E15A, ATSAML10E16A, ATSAML11E14A, ATSAML11E15A and ATSAML11E16A device families available in 32L VQFN (5x5x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final NotificationDescription of Change:Qualification of MP3A as a new assembly site for selected ATSAML1xE1xA device family available in 32L VQFN (5x5x1mm) package.Reason for Change:To improve manufacturability by qualifying MP3A as a new assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:August 31, 2023 (date code: 2335)
Microchip has released a new Datasheet for the SAM L10/L11 Family Data Sheet of devices. Notification Status: FinalDescription of Change: Revision H - 06/2023 In addition to the changes listed in the following table, there were numerous typographical updates that were made throughout the document.
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
