Manufacturer Part #
MCP1700T-1202E/MB
250MA CMOS LDO, ISUPPLY 1UA AND 2% VOUT ACCURACY
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel Package Style:SOT-89 (SC-62) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2526 | ||||||||||
Microchip MCP1700T-1202E/MB - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Revision History:August 30, 2023: Issued initial notification.September 7, 2023: Re-issued initial notification to remove MCP1700T-1802E/MBV05.January 23, 2024: Issued final notification. Updated post change paddle size from 71x79mils to 72x81mils and included backside coat details. Attached Qual Report and added the estimated first ship date on February 15, 2024.Description of Change:Qualification of GTBF as an additional assembly site for selected MCP11xT-xx, MCP170xT-xx, MCP170xRT-xx and MCP1703AT-xx device families available in 3L SOT-89 package.Reason for Change:To improve on-time delivery performance by qualifying GTBF as an additional assembly site.
Revision History:August 30, 2023: Issued initial notification.September 7, 2023: Re-issued initial notification to remove MCP1700T-1802E/MBV05.Description of Change:Qualification of GTBF as an additional assembly site for selected MCP11xT-xx, MCP170xT-xx, MCP170xRT-xx and MCP1703AT-xx device families available in 3L SOT-89 package.Reason for Change:To improve on-time delivery performance by qualifying GTBF as an additional assembly site.
Part Status:
Microchip MCP1700T-1202E/MB - Technical Attributes
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 6V |
| Output Voltage Fixed: | 1.2V |
| Dropout Voltage-Max: | 350mV |
| Output Current-Max: | 200mA |
| Package Style: | SOT-89 (SC-62) |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP1700T-1202E/MB is a 1.2 V, 250 mA Low Drop-Out Positive Voltage Regulator, available in SOT-89-3 package.
Features:
- 1.6 μA Typical Quiescent Current
- Input Operating Voltage Range: 2.3 V to 6.0 V
- Output Voltage Range: 1.2V to 5.0V
- 250 mA Output Current for output voltages ≥ 2.5V
- 200 mA Output Current for output voltages < 2.5V
- Low Dropout (LDO) voltage
- 178 mV typical @ 250 mA for VOUT = 2.8V
- 0.4% Typical Output Voltage Tolerance
- Standard Output Voltage Options:
- 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
- Stable with 1.0 μF Ceramic Output capacitor
- Short Circuit Protection
- Overtemperature Protection
Applications:
- Battery-powered Devices
- Battery-powered Alarm Circuits
- Smoke Detectors
- CO2 Detectors
- Pagers and Cellular Phones
- Smart Battery Packs
- Low Quiescent Current Voltage Reference
- PDAs
- Digital Cameras
- Microcontroller Power
Available Packaging
Package Qty:
1000 per Reel
Package Style:
SOT-89 (SC-62)
Mounting Method:
Surface Mount