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Manufacturer Part #
AT25M01-SHM-T
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2000 per Std. Mfr. Pkg
SOIC-8
Surface Mount
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Product Category: 8-Bit Microcontrollers, MemoryNotification Subject: CCB 8431.001 Initial Notice: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx,93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, 93C76Cxx, 93C86Cxx, AT93C8xx, 24LC02xx, 24LC01xx, 24AA01xx, 24AA02xx, AT24C0xx, 24AA04xx, ATtinyxx, AT25M0xx, AT24C5xx,AT24CMxx,25LC25xx,25AA25xxNote: See attached SPCN document for more detailed description Description of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx, 93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, Note: See attached SPCN document for more detailed description Reason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected 25AA128, 25AA256, 25LC128, 25LC256, AT25256B, AT25M01, ATtiny13, ATtiny13A, ATtiny25, ATtiny45 and ATtiny85 device families available in 8L SOIJ (.208in) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated First Ship Date: 10 July 2026 (date code: 2628)
Description of Change:Qualification of U08D as an additional fabrication site using 66.91K process technology for selected products of AT25M01, 25LC1024 and 25AA1024 device families available in 8L SOIC (.150in) , SOIJ (.208in), PDIP (.300in) and DFN-S (6x5x0.9mm) packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as an additional fabrication site using 66.91K process technology.
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Description of Change: Qualification of 66.9k wafer technology with QMI519 as a new die attach material and Au as a new wire material for selected 25AA1024, 25LC1024 and AT25M01 device families available in 8L SOIJ (.208in) package.Reason for Change: To improve manufacturability by qualifying 66.9k wafer technology with QMI519 as a new die attach material and Au as a new wire material.
Description of Change:Qualification of MTAI as an additional assembly site and test location for selected AT25256Bxx, AT24C512xx, AT24CM01xx, and AT25M01xx device families available in 8L SOIJ (.208in) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional assembly site and additional test location.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
