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Manufacturer Part #
S70KS1283GABHB020
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3380 per Tray
FBGA-24
Surface Mount
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Subject :Harmonization of marking and label for specified product families as per Infineon standards. Description:Old PACKING/SHIPPING - Change of labelling (applicable for all products) - 8 or 9 characters lot naming , Lot code not indicated , Double date code with 11 characters NEWPACKING/SHIPPING - Change of labelling (applicable for all products) - 11 characters lot naming , Lot code indicated (2/3 or 4 character) , Double date code with 8 characters Note: See attached SPCN document for more detailed descriptionReason : To support a uniform product identification and labeling approach across the portfolio, marking and labels are being aligned with Infineon standards. Intended start of delivery 2026-10-30 with the transfer being carried out in stages
Product discontinuationReason: Infineon 64 and 128Mbit HYPERRAM products based on 38nm technology will transition to 25nm technology due to the end of life of the 38nm process node. Infineon is actively developing products based on the replacement 25nm process and expects to release 25nm HYPERRAM products in mid-2027. In the case of 38nm HYPERRAM, Infineon is offering an extended Last Delivery Date (LDD) to allow customers to plan for a smooth transition. Note that 25nm HYPERRAM technology will not support 3-Volt power supplies and will not support the xSPI octal interface. Customers currently using HYPERRAM products with 3-Volt power supply and/or the xSPI octal interface must migrate to 1.8-Volt HYPERBUS products on the 25nm node. When such a migration is not possible, customers are encouraged to place complete last-time-buy orders as soon as possible. Contact Infineon for further details regarding replacement products and migration support. Last order date: 2027-09-30 Last delivery date: 2029-06-30
Subject: Change of logic circuits for specific automotive HYPERRAM products. Description:Old:Current logic circuitsNew:New logic circuits Reason:New metal mask revision to fix a logic circuit that causes a potential register read error during the HYPERRAM? products operation under specific boundary condition. Intended start of delivery: 2027-01-14
Subject : Change of label with Hal-free and/or Pb-free mark for various Memory Solutions products. Description:Old PACKING/SHIPPING: Change of labelling Label without Hal-freeNewPACKING/SHIPPING: Change of labelling Label with Hal-free and/or Pb-freeReason : Standardization of labelling for Infineon products. Deeper integration of supply chain and detailed assessment confirmed Halogen(Hal)-free and/or Lead(Pb)-free products in Infineon portfolio. Deliveries will start with 31.07.2026 to cascade information to Infineon customers with utmost urgencyIntended start of delivery :2026-08-07
Detailed change informationSubject Data sheet update for dual die HYPERRAM productsReason This information note serves to provide some clarifications to the register and memory space address map tables in dual die HYPERRAM datasheetsDescription Data sheet ?Correction of data sheet
Change of label affecting various Memory Solutions products: addition of HAL-free mark.Detailed change information:Subject: Change of label affecting various Memory Solutions products: addition of HAL-free markReason: Standardization of labelling for Infineon products.Deeper integration of supply chain and detailed assessment confirmed HAL-free products in Infineon portfolio.Deliveries will start with 2025-09-12 to cascade information to Infineon customers with utmost urgency.
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.