Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
24LC08B/SN
Download the CAD models for this product. Learn more about SnapMagic.
100 per Tube
SOIC-8
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: 8-Bit Microcontrollers, MemoryDescription of Change: Qualification of MMT as an additional assembly site for selected 24AA0xx, 24AA014x, 24AA024x, 24AA025, 24AA025Exx, 24AA025UID, 25LC080D, 24AA16, 24AA16H, 24FC0xx, 24FC16, 24FC16H, 24LC014x, 24LC024x, 24LC025, 24LC01Bx, 24LC02Bx, 24LC04Bx, 24LC08Bx, 24LC16Bx, 25AA080x, 25AA128, 25AA160x, 25AA256, 25AA320A, 25AA640A, 25CS160, 25CS320, 25CS640, 25LC080Cx, 25LC128, 25LC160x, 25LC256, 25LC320A, 25LC640A, 93AA76x, 93AA86x, 93C76x, 93C86x, 93LC76x, 93LC86x, AT24C01x, AT24C02x, AT24C04x, AT24C08x, AT24C16x, AT24CM02, AT25080B, AT25160B, AT93C86A, ATtiny13x and ATtiny25 device families available in 8L SOIC (.150in) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
*** Update of FPCN 119854 - Multiple Change Notification ***Revision History: March 12, 2026: Issued final notification.July 13, 2026: Re-issued final notification to remove the note referencing PCN CENO-16EGCZ399 for the QMI519 Qualification Report from the Pre and Post summary changes. Attached an additional Qualification Report for the Die Attach Material instead.Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for 24FC04, 24LC02BH, 24LC04B, 24FC02, 24LC02B, 24AA01, 24AA02, 24LC01B, 24LC04BH, 24FC04H, 24AA04, 24LC01BH, 24FC01, 24AA04H, 24AA01H, 24AA02H, AT24C08C, AT24C16D, 24AA16H, 24LC16BH, 24FC08, 24LC08B, AT24C16C, 24AA08H, 24AA08, 24AA16, 24LC08BH, 24FC16H, 24FC16, and 24LC16B device families available in 8L SOIC (3.90mm) package at MMT assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated First Ship Date: 03 June 2026 (date code: 2623)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for 24FC04, 24LC02BH, 24LC04B, 24FC02, 24LC02B, 24AA01, 24AA02, 24LC01B, 24LC04BH, 24FC04H, 24AA04, 24LC01BH, 24FC01, 24AA04H, 24AA01H, 24AA02H, AT24C08C, AT24C16D, 24AA16H, 24LC16BH, 24FC08, 24LC08B, AT24C16C, 24AA08H, 24AA08, 24AA16, 24LC08BH, 24FC16H, 24FC16, and 24LC16B device families available in 8L SOIC (3.90mm) package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated First Ship Date: 03 June 2026 (date code: 2623)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*** Update for PCN 113340 ***Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach materialRevision History: May 30, 2025: Issued final notificationJune 06, 2025: Re-issued final notification. Updated to Qualification Report Summary in Qual Report attachment.
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach material
Part Status:
The 24LC08B (24XX08*) series of 8 Kbit Electrically Erasable PROM is organized as four blocks of 256 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7 V, with standby and active currents of only 1 μA and 1 mA, respectively.
The 24XX08 also has a page write capability for up to 16 bytes of data. The 24XX08 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN, 2x3 TDFN and MSOP packages, and is also available in the 5-lead SOT-23 package. All packages are Pb-free and RoHS compliant.
Features:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.