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Manufacturer Part #
24LC128T-I/SM
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2100 per Reel
SOIJ-8
Surface Mount
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Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Description of Change:Added E-temp offerings to the AA and FC devices.Reason for Change: To improve productivity. Date Document Changes Effective: 25 Feb 2025
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date:27 March 2025 (date code: 2513)Revision History:January 18, 2025: Issued initial notification.February 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be March 27, 2025.
Description of Change: Qualification of QMI519 as a new die attach material for 24LC128-E/SM, 24LC128-I/SM, 24AA128-I/SM, 24FC128-I/SM, 24LC128T-I/SM, 24AA128T-I/SM, 24FC128T-I/SM and 24LC128T-E/SM catalog part numbers (CPN) available in 8L SOIJ (.208in) package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying QMI519 as a new die attach material assembled at MTAI.Estimated First Ship Date: 14 March 2025 (date code: 2511)
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
