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AT24C02D-SSHM-B
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100 per Tube
SOIC-8
Surface Mount
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Product Category: 8-Bit Microcontrollers, MemoryNotification Subject: CCB 8431.001 Initial Notice: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx,93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, 93C76Cxx, 93C86Cxx, AT93C8xx, 24LC02xx, 24LC01xx, 24AA01xx, 24AA02xx, AT24C0xx, 24AA04xx, ATtinyxx, AT25M0xx, AT24C5xx,AT24CMxx,25LC25xx,25AA25xxNote: See attached SPCN document for more detailed description Description of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx, 93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, Note: See attached SPCN document for more detailed description Reason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
Product Category: 8-Bit Microcontrollers, MemoryDescription of Change: Qualification of MMT as an additional assembly site for selected 24AA0xx, 24AA014x, 24AA024x, 24AA025, 24AA025Exx, 24AA025UID, 25LC080D, 24AA16, 24AA16H, 24FC0xx, 24FC16, 24FC16H, 24LC014x, 24LC024x, 24LC025, 24LC01Bx, 24LC02Bx, 24LC04Bx, 24LC08Bx, 24LC16Bx, 25AA080x, 25AA128, 25AA160x, 25AA256, 25AA320A, 25AA640A, 25CS160, 25CS320, 25CS640, 25LC080Cx, 25LC128, 25LC160x, 25LC256, 25LC320A, 25LC640A, 93AA76x, 93AA86x, 93C76x, 93C86x, 93LC76x, 93LC86x, AT24C01x, AT24C02x, AT24C04x, AT24C08x, AT24C16x, AT24CM02, AT25080B, AT25160B, AT93C86A, ATtiny13x and ATtiny25 device families available in 8L SOIC (.150in) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Product Category: Crypto Authentication, Crypto Memory, MemoryDescription of Change: Implement new packing materials and packing changes for AT34C02D, AT24C08D, AT24HC02C, AT88SC0104CA, AT88SC1616C, AT88SC0404CA, AT24MAC602, ATSHA204A, ATECC608A, ATECC508A, AT93C66B, ATECC108A, ATECC608C, AT24C16C, AT88SC0808CA, AT25160B, AT25080B, 25CS160, 24LC64, AT24C01C, AT24C04C, AT24C128C, AT24C04D, 24AA16H, AT24C08C, 24AA02H, 24LC04B, 24LC16B, AT93C56B, 24AA04H, 24AA01H, 24LC04BH, 24LC02BH, 24LC01BH, 25AA640A, 25LC640A, AT93C46E, 25CS640, AT24CM01, AT24C256C, 24AA256, AT24C512C, 24AA512, 24LC512, AT24C02C, AT25320B, 24LC256, 24FC256, 24FC512, AT24CM02, AT24C64B, AT24HC04B, AT24MAC402, AT24C16D, 25CSM04, AT93C86A, AT93C46D, AT24C02D and AT24C64D device families available in 8L SOIC and TSSOP (3.90mm and 4.4mm) packages.Reason for Change: To improve manufacturability by implementing new packing materials and packing changes.Estimated First Ship Date: 17 July 2026 (date code: 2629)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
*** Update for PCN 113340 ***Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach materialRevision History: May 30, 2025: Issued final notificationJune 06, 2025: Re-issued final notification. Updated to Qualification Report Summary in Qual Report attachment.
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach material
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