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Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
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Référence fabricant
AT24C128C-XHM-B
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100 par Std. Mfr. Pkg
TSSOP-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Product Category: Crypto Authentication, Crypto Memory, MemoryDescription of Change: Implement new packing materials and packing changes for AT34C02D, AT24C08D, AT24HC02C, AT88SC0104CA, AT88SC1616C, AT88SC0404CA, AT24MAC602, ATSHA204A, ATECC608A, ATECC508A, AT93C66B, ATECC108A, ATECC608C, AT24C16C, AT88SC0808CA, AT25160B, AT25080B, 25CS160, 24LC64, AT24C01C, AT24C04C, AT24C128C, AT24C04D, 24AA16H, AT24C08C, 24AA02H, 24LC04B, 24LC16B, AT93C56B, 24AA04H, 24AA01H, 24LC04BH, 24LC02BH, 24LC01BH, 25AA640A, 25LC640A, AT93C46E, 25CS640, AT24CM01, AT24C256C, 24AA256, AT24C512C, 24AA512, 24LC512, AT24C02C, AT25320B, 24LC256, 24FC256, 24FC512, AT24CM02, AT24C64B, AT24HC04B, AT24MAC402, AT24C16D, 25CSM04, AT93C86A, AT93C46D, AT24C02D and AT24C64D device families available in 8L SOIC and TSSOP (3.90mm and 4.4mm) packages.Reason for Change: To improve manufacturability by implementing new packing materials and packing changes.Estimated First Ship Date: 17 July 2026 (date code: 2629)
Description of Change: This qualification was originally performed to qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change: Microchip has decided to not qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date:27 March 2025 (date code: 2513)Revision History:January 18, 2025: Issued initial notification.February 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be March 27, 2025.
****FPCN110511 UPDATE****Description of Change: Qualification of new bill of materials (BOM) for selected 24LC128, 24AA128, 24FC128 and AT24C128C device families available in 8L TSSOP (4.4mm) package assembled at ANAP, ASSH and MMT assembly sites.Reason for Change: To improve manufacturability by qualifying new bill of materials (BOM) assembled at ANAP, ASSH and MMT assembly sites.
Description of Change: Qualification of CuPdAu as a new wire material and AMK-EP27 as a new die attach material for selected 24LC128, 24AA128, 24FC128 and AT24C128C device families available in 8LTSSOP (4.4mm) package assembled at ANAP, ASSH and MMT assembly sites.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material and AMK-EP27 as a new die attach material.
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
***FPCN110207 UPDATE***Revision History:May 22, 2023: Issued initial notification.July 01, 2024: Issued final notification. Attached the Qualification Report. Updated the pre and post change summary table to include Lead frame design information. Provided estimated first ship date to be on July 22, 2024.November 29, 2024: Re-issued final notification to reflect wire material Au in ANAP and ASSH assembly sites in the Pre and Post Change Summary.January 15, 2025: Re-issued final notification to reflect mold compound CEL-8240HF10P material in ANAP assembly site in the Pre and Post Change Summary. January 23, 2025: Re-issued the final notification to revise the comparison PDF file and reflect the mold compound CEL-8240HF10P material in ANAP assembly site.Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Description:CCB 6017 Final Notice: Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
***July 01, 2024: Issued final notification. Attached the Qualification Report***Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
