Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
AT24C64D-SSHM-B
AT24C64D Series 64 Kb (8 K x 8) I2C-Compatible (2-Wire) Serial EEPROM - SOIC-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip AT24C64D-SSHM-B - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
Description of Change: Qualification of CuPdAu as a new wire material, QMI-519 and AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound for selected 24AA32Ax, 24AA64x, 24FC64x, 24LC32Ax, 24LC64x, AT24C32x, and AT24C64x device families available in 8L SOIC (3.90mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material, QMI-519 and AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound.Estimated First Ship Date: 31 March 2025 (date code: 2514)
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24C64D-SSHM-B&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24c64d-sshm-b-microchip-7107019
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24C64D-SSHM-B&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24c64d-sshm-b-microchip-7107019
Microchip AT24C64D-SSHM-B - Technical Attributes
| Memory Density: | 64kb |
| Memory Organization: | 8 K x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount