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Manufacturer Part #
ATSAMD21J18A-AUT
64TQFP IND TEMP, GREEN,1.6-3.6V,48MHz
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:1500 per Reel Package Style:TQFP-64 Mounting Method:Surface Mount |
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| Date Code: | 2544 | ||||||||||
Microchip ATSAMD21J18A-AUT - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
UPDATE TO Future PCN 116118 and PCN 116159.Revision History: September 22, 2025: Issued final notification.September 23, 2025: Re-issued final notification to correct the Post Change for wire material to be Au and CuPdAu on the Pre and Post Change Summary table.October 01, 2025: Re-issued final notification to correct the Post Change wire material on the Pre and Post Change Summary table and align with the updated Qual Report attachment.Description of Change: Qualification of CuPdAu as an additional wire material for selected ATSAMD20J17, ATSAMC20J15A, ATSAMC20J16A, ATSAMC20J17A, ATSAMC20J18A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD20J14, ATSAMD20J15, ATSAMD20J16, ATSAMD20J18, ATSAMD21J15, ATSAMD21J16, ATSAMD21J17, ATSAMD21J18, ATSAMDA1J14B, ATSAMDA1J15B, ATSAMDA1J16B, PIC32CM1602GV00064, PIC32CM2532JH00064, PIC32CM2532JH01064, PIC32CM2532LE00064, PIC32CM2532LS00064, PIC32CM3204GV00064, PIC32CM3204JH00064, PIC32CM5164JH00064, PIC32CM5164JH01064, PIC32CM5164LE00064, PIC32CM5164LS00064 and PIC32CM6408JH00064 device families available in 64L TQFP (10x10x1mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional wire material.
***UPDATE OF PCN116118***Description of Change: Qualification of CuPdAu as an additional wire material for selected ATSAMD20J17, ATSAMC20J15A, ATSAMC20J16A, ATSAMC20J17A, ATSAMC20J18A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD20J14, ATSAMD20J15, ATSAMD20J16, ATSAMD20J18, ATSAMD21J15, ATSAMD21J16, ATSAMD21J17, ATSAMD21J18, ATSAMDA1J14B, ATSAMDA1J15B, ATSAMDA1J16B, PIC32CM1602GV00064, PIC32CM2532JH00064, PIC32CM2532JH01064, PIC32CM2532LE00064, PIC32CM2532LS00064, PIC32CM3204GV00064, PIC32CM3204JH00064, PIC32CM5164JH00064, PIC32CM5164JH01064, PIC32CM5164LE00064, PIC32CM5164LS00064 and PIC32CM6408JH00064 device families available in 64L TQFP (10x10x1mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional wire material.Estimated First Ship Date: 13 November 2025 (date code: 2546)
Description of Change: Qualification of CuPdAu as an additional wire material for selected ATSAMD20J17, ATSAMC20J15A, ATSAMC20J16A, ATSAMC20J17A, ATSAMC20J18A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD20J14, ATSAMD20J15, ATSAMD20J16, ATSAMD20J18, ATSAMD21J15, ATSAMD21J16, ATSAMD21J17, ATSAMD21J18, ATSAMDA1J14B, ATSAMDA1J15B, ATSAMDA1J16B, PIC32CM1602GV00064, PIC32CM2532JH00064, PIC32CM2532JH01064, PIC32CM2532LE00064, PIC32CM2532LS00064, PIC32CM3204GV00064, PIC32CM3204JH00064, PIC32CM5164JH00064, PIC32CM5164JH01064, PIC32CM5164LE00064, PIC32CM5164LS00064 and PIC32CM6408JH00064 device families available in 64L TQFP (10x10x1mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional wire material.Estimated First Ship Date: 13 November 2025 (date code: 2546)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:The following updates were performed in this revision:? Updated the document throughout to reflect new silicon revisions H, I, and J? Removed obsolete Data Sheet Clarifications? Added errata Device: 1.5.9 One-Time Programmable LockPlease be advised that this is a change to the document only the product has not been changed.Reason for Change: To Improve Productivity
Part Status:
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Microchip ATSAMD21J18A-AUT - Technical Attributes
| Core Processor: | ARM® Cortex®-M0+ |
| RAM Size: | 32kB |
| Speed: | 48MHz |
| InterfaceType / Connectivity: | I2C/LIN |
| Peripherals: | Brownout Reset/Brown-out Detect |
| Supply Voltage: | 1.62V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 20-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Package Style: | TQFP-64 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1500 per Reel
Package Style:
TQFP-64
Mounting Method:
Surface Mount