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Référence fabricant
ATMEGA16L-8AUR
ATmega Series 16 KB Flash 1 KB SRAM 8 MHz 8-Bit Microcontroller - TQFP-44
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2000 par Reel | ||||||||||
| Code de date: | |||||||||||
Microchip ATMEGA16L-8AUR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT42QT1481, AT42QT2640, AT89LP3240, AT89LP51, AT89LP51xxx, AT89LP52, AT89LP6440, AT89S8253, ATmega1284, ATmega1284P, ATmega16, ATmega16xx, ATmega32, ATmega32xx, ATmega644, ATMEGA644PA, ATmega85xx, ATxmega128xxx, ATxmega16xxxx, ATxmega32xxxx, ATxmega64xx, QT60326, QT6C1x, QT6C21 and QT6E22 device families available in 44L TQFP (10x10x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 22 July 2025 (date code: 2530)
Revision History:September 27, 2023: Issued initial notification.June 24, 2024: Issued cancellation notification.PCN Status:Cancellation NotificationDescription of Change:This qualification was originally performed to qualify Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected AT42QT1xx, AT90PWM81xx, ATMEGA128xx, ATMEGA16xx, ATMEGA32xx, ATMEGA64xx, ATMEGA8xx and ATTINYxx device families available in various packages
***Cancellation Notification***Description of Change:This qualification was originally performed to qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.Reason for ChangeMicrochip has decided to not qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.
PCN Status: Final NotificationDescription of Change: Qualification of ASE9 as a new final test site for selected ATMEGA16xx, ATMEGA32xx, ATMEGA644xx, and ATMEGA85xx device families available in 44L TQFP (10x10x1mm) package.Reason for Change: To improve productivity by qualifying ASE9 as a new final test site.
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected AT42QT1xx, AT90PWM81xx, ATMEGA128xx, ATMEGA16xx,ATMEGA32xx, ATMEGA64xx, ATMEGA8xx and ATTINYxx device families available in various packages.Reason for Change:To improve on-time delivery performance byqualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site.
PCN Status:Initial NotificationDescription of Change:Qualification of ASE9 as a new final test site for selected ATMEGA16xx, ATMEGA32xx, ATMEGA644xx, and ATMEGA85xx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve productivity by qualifying ASE9 as a new final test site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:November 2023
Revision History:July 25, 2023: Issued initial notification.August 02, 2023: Re-issued initial notification to correct the typo error for LPI carrier tape data. Updated the PCN letter and ppt file to reflect that there are no dimensional changes in carrier tape.Description of Change:Qualification of ASE9 as a new final test site for selected ATMEGA16xx, ATMEGA32xx, ATMEGA644xx, and ATMEGA85xx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve productivity by qualifying ASE9 as a new final test site.
Revision History:June 24, 2022: Issued final notification. Attached is the qualification report and provided estimated first ship date by July 15, 2022.July 01, 2022: Re-issued final notification. Added MSL Classification Level and Tray comparison in Pre and Post change summary table. Added attachment file (ppt) for Tray comparison.Description of Change:Qualification of MTAI as a new assembly site for selected ATMEGA1284x, ATMEGA16xxx, ATMEGA32xxx, ATMEGA644xx and ATMEGA85x5x device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as a new assembly site.
Description of Change:Qualification of MTAI as a new assembly site for selected ATMEGA1284x, ATMEGA16xxx, ATMEGA32xxx, ATMEGA644xx and ATMEGA85x5x device families available in 44L TQFP (10x10x1mm) package.'Reason for Change: To improve manufacturability and on-time delivery performance by qualifying MTAI as a new assembly site.Estimated First Ship Date: July 15, 2022 (date code: 2229)
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
2000 par Reel