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Manufacturer Part #
ATTINY13-20SSU
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100 per Tube
SOIC-8
Surface Mount
Shipping Information:
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PCN Information:
Product Category: 8-Bit Microcontrollers, MemoryDescription of Change: Qualification of MMT as an additional assembly site for selected 24AA0xx, 24AA014x, 24AA024x, 24AA025, 24AA025Exx, 24AA025UID, 25LC080D, 24AA16, 24AA16H, 24FC0xx, 24FC16, 24FC16H, 24LC014x, 24LC024x, 24LC025, 24LC01Bx, 24LC02Bx, 24LC04Bx, 24LC08Bx, 24LC16Bx, 25AA080x, 25AA128, 25AA160x, 25AA256, 25AA320A, 25AA640A, 25CS160, 25CS320, 25CS640, 25LC080Cx, 25LC128, 25LC160x, 25LC256, 25LC320A, 25LC640A, 93AA76x, 93AA86x, 93C76x, 93C86x, 93LC76x, 93LC86x, AT24C01x, AT24C02x, AT24C04x, AT24C08x, AT24C16x, AT24CM02, AT25080B, AT25160B, AT93C86A, ATtiny13x and ATtiny25 device families available in 8L SOIC (.150in) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AT24C04C, AT24C02C, AT24C01C, AT24C32D, AT24C256C, ATtiny25, ATtiny13A, ATtiny13, 25LC256, 25AA256, 25LC128 and 25AA128 device families available in 8L SOIC (.150in).Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.
Description of Change: Qualification of MTAI as a new final test site for selected ATTINY13x device family available in 8L SOIC (0.15 in) and 8L SOIJ (0.208 in) packages.Reason for Change: To improve manufacturability by qualifying MTAI as new final test site.
PCN Type:Manufacturing Change Description of Change:Qualification of MTAI as a new final test site for selected ATTINY13xx device family available in 8L SOIC (0.15 in) and 8L SOIJ (0.208 in) packages.Pre and Post Change Summary: For 8L SOIC Package: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as new final test site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change:Qualification of MTAI as an additional assembly site for selected ATtiny13, ATtiny25 and QT113B device families available in 8L SOIC 3.90mm(.150in) package with MSL 1classification.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
