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Manufacturer Part #
ATTINY25V-10SSUR
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4000 per Reel
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AT24C04C, AT24C02C, AT24C01C, AT24C32D, AT24C256C, ATtiny25, ATtiny13A, ATtiny13, 25LC256, 25AA256, 25LC128 and 25AA128 device families available in 8L SOIC (.150in).Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.
***June 12, 2024: Issued cancellation notification***Description of Change:This qualification was originally performed to qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.Reason for Change:Microchip has decided to not qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.
Revision History:October 12, 2023: Issued initial notification.February 12, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on April 01, 2024.Description of Change:\Qualification of MTAI as the new test location for selected ATTINY85xx, ATTINY45xx, and ATTINY25xx device families available in 8L SOIJ (.208in) and 8L SOIC (.150in) packages.Reason for Change:To improve manufacturability by qualifying MTAI as the new final test site.
PCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Qualification of MTAI as the new test location for selected ATTINY85xx, ATTINY45xx, and ATTINY25xx device families available in 8L SOIJ (.208in) and 8L SOIC (.150in) packages. Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as the new final test site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change:Qualification of MTAI as an additional assembly site for selected ATtiny13, ATtiny25 and QT113B device families available in 8L SOIC 3.90mm(.150in) package with MSL 1classification.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
