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Manufacturer Part #
M2S005S-VFG256I
SmartFusion2; 256 VFPGA 14x14
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:119 per Tray Package Style:LFBGA-256 Mounting Method:Surface Mount |
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| Date Code: | 2529 | ||||||||||
Microchip M2S005S-VFG256I - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for FPCN 110718 ***Description of Change:Qualification of MTAI as an additional In-House Programming (IHP) site for selected M2GL005x, M2GL010xx, M2GL025xx, M2GL050xx, M2GL060xx, M2GL090xx, M2GL150xx, M2S005x, M2S010xx, M2S025xx, M2S050xx, M2S060xx, M2S090xx and M2S150xx device families available in various packages.Reason for Change:To improve manufacturability by qualifying MTAI as an additional in-house programming site.Estimated First Ship Date:February 14, 2025 (date code: 2507)Revision History:January 14, 2025: Issued final notification.February 06, 2025: Re-issued final notification to remove M2S010-1VFG256I, M2GL005-VFG256I, M2S005-VFG256IZ049, M2GL005-VFG256, M2S005S-DIELOTWX551, M2S005S DIELOTWX552, M2S005S-DIELOTW, M2S025TS-DIELOTW, M2S025TS-DIELOTWX553, M2S010TS-DIELOTW, M2S150TS-DIELOTWX555, M2S150TS-DIELOTW, M2S150TS DIELOTWX556, M2S090TS-DIELOTW, M2S060TS-DIELOTWX554, M2S060TS-DIELOTW, M2S025-FCSG325, M2S025T-FCSG158IZ222, M2S025T-1FCSG158HZ221 and M2GL025T FGG484 catalog part numbers (CPN) and added M2S010-1TQG144Q384, M2S010-1TQG144Q383, M2S025TS-VFG256S0055, M2S025TS-FGG484H0414, M2S060TS FGG484IH0437 and M2S060TS-FGG484IH0447 catalog part numbers (CPN). April 07, 2025: Re-issued final notification to remove CPNs M2GL025-1FGG484T1X7, M2GL005S-1VFG256T2, M2GL010-1FGG484T1 and M2GL025-1FGG484T1 in the Affected CPN due to updated scope. Remove CPNs M2S090-FCS325X339, M2GL010-FG484MX399 and M2S090-FGG676ORT due to being EOL.
Description of Change:Qualification of MTAI as an additional In-House Programming (IHP) site for selected M2GL005x, M2GL010xx, M2GL025xx, M2GL050xx, M2GL060xx, M2GL090xx, M2GL150xx, M2S005x, M2S010xx, M2S025xx, M2S050xx, M2S060xx, M2S090xx and M2S150xx device families available in various packages.Reason for Change:To improve manufacturability by qualifying MTAI as an additional in-house programming site.Estimated First Ship Date:February 14, 2025 (date code: 2507)Revision History:January 14, 2025: Issued final notification.February 06, 2025: Re-issued final notification to remove M2S010-1VFG256I, M2GL005-VFG256I, M2S005-VFG256IZ049, M2GL005-VFG256, M2S005S-DIELOTWX551, M2S005S-DIELOTWX552, M2S005S-DIELOTW, M2S025TS-DIELOTW, M2S025TS-DIELOTWX553, M2S010TS-DIELOTW, M2S150TS-DIELOTWX555, M2S150TS-DIELOTW, M2S150TS-DIELOTWX556, M2S090TS-DIELOTW, M2S060TS-DIELOTWX554, M2S060TS-DIELOTW, M2S025-FCSG325, M2S025T-FCSG158IZ222, M2S025T-1FCSG158HZ221 and M2GL025T-FGG484 catalog partnumbers (CPN) and added M2S0101TQG144Q384, M2S010-1TQG144Q383, M2S025TS-VFG256S0055, M2S025TS-FGG484H0414, M2S060TS-FGG484IH0437 and M2S060TS-FGG484IH0447 catalog part numbers (CPN).
Description of Change:In the revision E of this document, the Table 3-2 was updated inserting a note to assert that the product is designed and validated for operation within the junction temperature (TJ) range.Reason for Change: To Improve ProductivityDate Document Changes Effective: 28 Jan 2025Revision History:January 29, 2025: Issued Document PCN.January 31, 2025: Re-issued Document PCN to revise affected CPN list.
Description of Change:Qualification of MTAI as an additional In-House Programming (IHP) site for selected M2GL005x, M2GL010xx, M2GL025xx, M2GL050xx, M2GL060xx, M2GL090xx, M2GL150xx, M2S005x, M2S010xx, M2S025xx, M2S050xx, M2S060xx, M2S090xx and M2S150xx device families available in various packages.Reason for Change:To improve manufacturability by qualifying MTAI as an additional in-house programming site.
Microchip has released a new Datasheet for the SmartFusion 2 and IGLOO 2 Automotive Grade 2 Datasheet of devices. If you are using one of these devices please read the document located at SmartFusion 2 and IGLOO 2 Automotive Grade 2 Datasheet.Notification Status: FinalDescription of Change:Revision B The following is a list changes made in this revision:? Added the Ordering Information section for Automotive Grade 2 IGLOO 2 and SmartFusion 2 SoC.? Updated the hyperlink for the IGLOO? 2 FPGA Product Brief in the Product Briefs and Pin Descriptions section.? Updated the table links in Section 1.1 Operating Conditions.? Removed Bank0 and Bank5 for VREFx from Table 1-2.? Added Note 3 on MSIO, MSIOD, and DEVRST pins to Table 5-3.? Updated Table 7-27 by adding a note to the table on JTAG IOs.? Updated Table 7-28, Table 7-29, Table 7-31, and Table 7-32 by adding note that the power-up to Functional time in the tables do not consider SUSPEND_MODE.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 24 Jun 2024NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
PCN Status:Final NotificationDescription of Change:Release of updated software version of Synplify Pro Microchip Edition v2023.09M-1 & Synplify Pro Standalone v2023.09-1 for various FPGA devices.Reason for Change:Synplify Pro standalone all-vendor versions 2023.03 and 2023.09, as well as Microchip Edition version 2023.09M could incorrectly extract the enable signal logic during RTL synthesis when the signal path contains a set of multiplexors connected in series around a register, and the MUXs are driven by bus ports. This is described in the attached Customer Notice.
Microchip has released a new Document for the SmartFusion 2 and IGLOO 2 FPGA High-Speed Serial Interface User Guide of devices.Description of Change:The following is a summary of the changes made in this revision.? Added a note in 4.6.2.1.5. AXI3 Slave Block regarding the supported read and write burst types.? Added third point in the note under Table 4-4 to describe the usage of Byte 7 of the TLP Header when word widths less than 64-bit are required.? Added ?PCIE_? prefix to the PCIE_DEV2SCR and PCIE_LINK2SCR registers in 4.10.10. PCIe Control and Status Registers.? Updated Figure 6-12. Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: Complete
Revision History:September 27, 2023: Issued initial notification.February 14, 2024: Issued final notification. Attached the Qualification Report. Updated affected parts list. Provided estimated first ship date to be on February 29, 2024.Description of Change:Qualification of ARDE as an additional final test site for M2S005x and M2GL005x device families available in 256L LFBGA (14x14x1.56mm) package.Reason for Change:To improve on-time delivery performance by qualifying ARDE as an additional final test site.
Microchip has released a new Datasheet for the IGLOO? 2 FPGA and SmartFusion? 2 SoC FPGA Datasheet of devices. If you are using one of these devices please read the document located at IGLOO? 2 FPGA and SmartFusion? 2 SoC FPGA Datasheet.Notification Status: FinalDescription of Change: ? The "INTRODUCTION" section was updated by adding part numbers with prefixes for IGLOO 2 and SmartFusion 2.? Updated the minimum timing values of SP6-SP9 in Table 3-274.? Added ?DEVRST_N pulse width? details to DEVRST_N Characteristics in Table 3-278.? Removed bank numbers for FDDR and MDDR Reference voltage supply in Table 3-2.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 31 January 2024NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Part Status:
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Microchip M2S005S-VFG256I - Technical Attributes
| No of I/O Lines: | 161 |
| Operating Frequency-Max: | 142MHz |
| RAM Size (Bits): | 191kb |
| Supply Voltage: | 1.14V to 1.26V |
| Operating Temp Range: | -40°C to +100°C |
| Storage Temperature Range: | -65°C to +150°C |
| Interface Type: | Jtag |
| Temperature Grade: | Industrial |
| Moisture Sensitivity Level: | 3 |
| Package Style: | LFBGA-256 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
119 per Tray
Package Style:
LFBGA-256
Mounting Method:
Surface Mount