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Référence fabricant
1410187-3
MULTIGIG: 7 Row 112 Position 1.8 mm Right Angle Daughtercard Plug Connector
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| Nom du fabricant: | TE Connectivity | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :17 par Tube Méthode de montage :Through Hole | ||||||||||
| Code de date: | 2237 | ||||||||||
TE Connectivity 1410187-3 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of ChangesOutside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA.Reason for Changes:New manufacturing facility.First Date To Ship (Changed Parts Only): 15-OCT-2025Last Date for Mixed Shipments: (Changed Parts Only): 22-OCT-2025
*****DO NOT ISSUE/DUPLICATE TO FPCN112844******Description of ChangesCurrent Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification.Reason for Changes:Product improvement. This change contributes to our continued quality improvement, performance, and sustainability objectives.
******FPCN112844 UPDATE*******Description of Change:Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification.Reason for Change:Product improvement. This change contributes to our continued quality improvement, performance, and sustainability objectives.
Description of ChangesCurrent Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification.Reason for Changes:Product improvement. This change contributes to our continued quality improvement, performance, and sustainability objectives.Reason for Changes:Product improvement. This change contributes to our continued quality improvement, performance, and sustainability objectives.
Description of Change:Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process.Reason for Changes:Product improvement. Reduce FOD (Foreign Object Debris) during assembly process.
Subject: NOE-23-053 ? Multigig Daughtercard Connectors ? Update Update Summary:? Our supplier has provided an 8D report to TE Connectivity (TE) and we have completed our internal 8D report. This report is available upon request.? As previously communicated, our Risk Assessment testing is complete. Results showed that product performed per the TE Product Specification. We have internally dispositioned product Use-As-Is.? Because tested product performed per the Product Specification, we continue to recommend a use-as-is disposition to our customers.? We expect to issue a formal closure letter regarding this NOE no later than February 28, 2025.
Subject: NOE-23-053 ? Multigig Daughtercard Connectors ? UpdateUpdate Summary:Our supplier is conducting tests to identify root cause of the PCB tape test failure reported in our previous update. We expect results in late November 2024.Our supplier has provided on-site resources to 100% tape test current inventory of PCBs with TE supervision. No additional tape test failures have been identified to date.Our Risk Assessment testing is ongoing. The planned completion date is December 12, 2024.We will continue to supply parts that have been produced using 100% tape tested wafers and/or material from an alternate supplier.
Attn: Purchasing and Quality DepartmentsSubject: NOE-23-053 ? Multigig Daughtercard Connectors ? Update Update Summary:? TE has identified a PCB tape test failure at receiving inspection on new production from our supplier with date code 3724 (WWYY). This batch of material was not used in TE production.? TE has quarantined all material received from the supplier until tape testing can be completed on 100% of the PCBs.? TE has conducted an on-site audit of the supplier and is investigating the failure identified at receiving inspection.? TE will continue to supply parts that have been produced using 100% tape tested wafers and/or material from an alternate supplier.
Attn: Purchasing and Quality DepartmentsSubject: NOE-23-053 ? Multigig Daughtercard Connectors ? UpdateUpdate Summary:? TE has expanded the scope of this Notice of Escape to date code range 2107 through 2408? The root cause, failure mode, and corrective action remain the same? TE will provide a testing progress update on or before October 28, 2024
Subject: NOE-23-053 ? Multigig Daughtercard Connectors ? UpdateUpdate Summary:? TE is re-evaluating the scope of this Notice of Escape? The root cause, failure mode, and corrective action remain the same? TE?s supplier is still in the process of reviewing their production records and has not provided details to TE as of this letter. TE will provide a status update on or before September 13, 2024.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=1410187-3&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--backplane-connectors--backpanel-connectors/1410187-3-te-connectivity-9223348
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=1410187-3&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--backplane-connectors--backpanel-connectors/1410187-3-te-connectivity-9223348
TE Connectivity 1410187-3 - Caractéristiques techniques
| Type: | Plug |
| Style/Orientation: | Right Angle Header/Plug |
| No of Positions: | 112 |
| No of Rows: | 7 |
| Pitch: | 1.8 mm |
| Termination: | Solder |
| Contact Plating: | Gold |
| Current Rating: | 1A |
| Operating Temp Range: | -55°C to +105°C |
| Color: | Black |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
17 par Tube
Méthode de montage :
Through Hole