Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
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Référence fabricant
MCP616-I/SN
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100 par Tube
SOIC-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update of FPCN 119174/MULTIPLE CHANGE/Attached the Qualification Report. Provided estimated first ship date to be on August 16, 2026. ***Revision History: February 06, 2026: Issued initial notification. June 25, 2026: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 16, 2026.Product Category: Linear Comparators, Linear Op AmpsDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected MCP601, MCP603, MCP6041, MCP6043, MCP606, MCP608, MCP6141, MCP6143, MCP616, MCP6231, MCP6241, MCP6271, MCP6273, MCP6281, MCP6283, MCP6291, MCP6293, MCP6541, MCP6546, MCP6L1 and MCP6L71 device families available in 8L SOIC (.150in) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: 16 August 2026 (date code: 2633)
Product Category: Linear Comparators, Linear Op AmpsDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected MCP601, MCP603, MCP6041, MCP6043, MCP606, MCP608, MCP6141, MCP6143, MCP616, MCP6231, MCP6241, MCP6271, MCP6273, MCP6281, MCP6283, MCP6291, MCP6293, MCP6541, MCP6546, MCP6L1 and MCP6L71 device families available in 8L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: March 2026
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
