Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
MIC2544-2YM
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95 par Tube
SOIC-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for selected MIC2012, MIC2025, MIC2026, MIC2042, MIC2043, MIC2075, MIC2076, MIC2172, MIC2536, MIC2544, MIC2544A, MIC2545A, MIC2548, MIC2548A, MIC2549A, MIC2582, MIC2587, MIC29201, MIC29204, MIC2951, MIC2954, MIC3172, MIC3203, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC38HC42, MIC38HC43, MIC38HC44, MIC38HC45, MIC4223, MIC4224, MIC4225, MIC4801, MIC5014, MIC5015, MIC5020, MIC5021, MIC5156, MIC5200, MIC5201 and MIC5202 device families available in 8L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
Statut du produit:
The MIC2544 and MIC2548 are integrated, high-side power switches optimized for low loss DC power switching and other power management applications, including Advanced Configuration and Power Interface (ACPI). The MIC2544/48 is a cost-effective, highly integrated solution that requires few external components to satisfy USB and ACPI requirements.
Product Features:
Applications:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
