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Référence fabricant
MIC5353YMT-TR
MIC5353 Series 500 mA Adjustable Surface Mount Voltage Regulator - TMLF-6
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :TMLF-6 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC5353YMT-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Microchip has released a new Datasheet for the MIC5353 - 500mA LDO in 1.6mm x 1.6mm Package of devices.Description of Change:• Updated the “Product Identification System” section.• Updated the Package Outline Drawing.Reason for Change: To improve productivityNOTE: Please be advised that this is a change to the document only the product has not been changed.
*** Update for PCN 112974 ***Revision History: May 13, 2025: Issued initial notification.July 23, 2025: Issued final notification. Attached Qualification Report. Provided estimated first ship date to be on July 31, 2025.Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC94345, MIC2095, MIC2097, MIC2098, MIC2099, MIC23030, MIC23031, MIC2791, MIC5265, MIC5301, MIC5304, MIC5308, MIC5309, MIC5318, MIC5320, MIC5321, MIC5322, MIC5335, MIC5353, MIC5367, MIC5368, MIC5370, MIC5371, MIC5512, MIC5514, MIC826, MIC841, MIC94305, MIC94325 and MIC94355 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.Estimated First Ship Date: 31 July 2025 (date code: 2531)
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC94345, MIC2095, MIC2097, MIC2098, MIC2099, MIC23030, MIC23031, MIC2791, MIC5265, MIC5301, MIC5304, MIC5308, MIC5309, MIC5318, MIC5320, MIC5321, MIC5322, MIC5335, MIC5353, MIC5367, MIC5368, MIC5370, MIC5371, MIC5512, MIC5514, MIC826, MIC841, MIC94305, MIC94325 and MIC94355 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC5353YMT-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--linear-regulators/mic5353ymt-tr-microchip-3001034
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC5353YMT-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--linear-regulators/mic5353ymt-tr-microchip-3001034
Microchip MIC5353YMT-TR - Caractéristiques techniques
| Input Voltage-Min: | 2.6V |
| Input Voltage-Max: | 6V |
| Output Voltage Range: | 1.25V to 5.5V |
| Dropout Voltage-Max: | 350mV |
| Output Current-Max: | 500mA |
| Operating Temp Range: | -65°C to +150°C |
| Regulator Topology: | Adjustable Fixed |
| Quiescent Current: | 90µA |
| No. of Outputs: | Single |
| Output Noise: | 30µV |
| Load Regulation (%): | 2% |
| Current - Limit: | 1600mA |
| Line Regulation (%): | 0.6% |
| Style d'emballage : | TMLF-6 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
TMLF-6
Méthode de montage :
Surface Mount