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Manufacturer Part #
APTGLQ75H65T1G
APTGLQ75x Series 650 V 150 A High Speed Trench + Field Stop IGBT4 Power Module
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:16 per Tube Package Style:SP-1 Mounting Method:Through Hole | ||||||||||
| Date Code: | |||||||||||
Microchip APTGLQ75H65T1G - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of INMK as an additional fabrication site for selected APT100GLQ65Jxxx, APT50GLQ65JU2, APTGLQxxx, CMTDGLQxxx, MSCGLQxxx, CMGIGLQ300xxx, CMHS50GLQ65JCU2 and CMMIGLQ100X065CTYZBNMG device families available in 650V IGBT3 High Speed and Medium Power bare die products.Reason for Change:To improve on-time delivery performance by qualifying INMK as an additional fabrication site.
Microchip has released a new Errata for the SP1 to SP1F Module Package Data Sheet Clarification Errata of devices. If you are using one of these devices please read the document located at SP1 to SP1F Module Package Data Sheet Clarification Errata.Notification Status: FinalDescription of Change: Added SP1F package schematic images.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 03 November 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Revision History:January 17, 2023: Issued initial notification.February 23, 2023: Re-issued initial notification to add the catalog part number APTDR90X1601G to the affected CPN list as part of the scope.August 8, 2023: Issued final notification. Attached the Qual report and included the estimated first ship date on August 29, 2023.Description of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP1 package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:August 29, 2023 (date code: 2335)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Microchip has released a new Errata for the SP1 to SP1F Module Package Update Errata of devices. Notification Status: FinalDescription of Change: Initial releaseImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Jul 2023
PCN Status:Initial NotificationDescription of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP1 package.Reason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2023
Description of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP1 package.Reason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2023
Part Status:
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Microchip APTGLQ75H65T1G - Technical Attributes
| CE Voltage-Max: | 650V |
| Collector Current @ 25C: | 100A |
| Power Dissipation-Tot: | 250W |
| Gate - Emitter Voltage: | ±20V |
| Pulsed Collector Current: | 200A |
| Collector - Emitter Saturation Voltage: | 1.85V |
| Turn-on Delay Time: | 19ns |
| Turn-off Delay Time: | 197ns |
| Qg Gate Charge: | 440nC |
| Reverse Recovery Time-Max: | 100ns |
| Leakage Current: | 100µA |
| Input Capacitance: | 4620pF |
| Thermal Resistance: | 0.6°C/W |
| Operating Temp Range: | -40°C to +175°C |
| Package Style: | SP-1 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
16 per Tube
Package Style:
SP-1
Mounting Method:
Through Hole