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Manufacturer Part #
ZL30772LFG7
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176 per Tray
Surface Mount
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Product Category: Jitter Attenuators, Network SynchronizationDescription of Change: Qualification of HR-5104 as a new die attach material for Die #3 and EMS526 as a new substrate core material for selected ZL30256, ZL30683, ZL30772, ZL80062, ZL30671, ZL30672, ZL30673, ZL30681, ZL30682, ZL30771, ZL30773, ZL30792, ZL30803, ZL30806, ZL30822, ZL30664, ZL30794, ZL30661, ZL30663, ZL30793, ZL30795, ZL30693, ZL30662, ZL30691, ZL30692, ZL80062A and ZL30791 device families available in 80L VFLGA (11x11x0.81mm) package at ASCL assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying HR-5104 as a new die attach material for Die #3 and EM-S526 as a new substrate core material at ASCL assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: February 2027
Product Category: Clock And Timing - Clock Generation, Jitter Attenuators, Network SynchronizationNotification Subject: CCB 8417 and 8451 Initial Notice: Qualification of a new die size (1.560 x 0.863 mm) for Die #2 of selected ZL3073xx, ZL3027xx, ZL3064xx, ZL3063xx, ZL8003xx, ZL8073xx, ZL8013xx, ZL8083xx, ZL3083xx, ZL3093xx, ZL8064xx and ZL8093xx device families and qualification of a new die size (1.560 x 0.863 mm) for Die #3 of selected ZL302xx, ZL306xx, ZL307xx, ZL800xx and ZL308xx device families using HR-5104 as a new die attach material available in various packagesDescription of Change: Qualification of a new die size (1.560 x 0.863 mm) for Die 2 of selected ZL3073xx, ZL3027xx, ZL3064xx, ZL3063xx, ZL8003xx, ZL8073xx, ZL8013xx, ZL8083xx, ZL3083xx, ZL3093xx, ZL8064xx and ZL8093xx device families and Note: See attached SPCN document for more detailed descriptionPre and Post Summary Changes:For ZL30735, ZL30271, ZL30273, ZL30274, ZL30642, ZL30643, ZL30645, ZL30634, ZL30732, ZL30644, ZL30734, ZL30733, ZL30632, ZL30633, ZL30635, ZL80032, ZL30631, ZL30640, ZL30641, ZL30731, ZL30634A, ZL30642A, ZL80732, ZL30640A, ZL80132,, Note: See attached SPCN document for more detailed description Reason for Change: To improve productivity by qualifying a new die size and new die attach material.Estimated Qualification Completion Date: January 2027Revision History: August 20, 2026: Issued initial notification
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
PCN Status:Final NotificationDescription of Change:Qualification of ASEM as an additional assembly site for ZL30256, ZL306xx, ZL307xx, ZL308xx and ZL800xx device families available in 80L VFLGA (11x11x0.9mm) package.Reason for Change:To improve on-time delivery performance by qualifying ASEM as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:March 24, 2023 (date code: 2312)
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
