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Référence fabricant
SY100EP111UTG-TR
SY100EP Series 3.8 V 1:10 LVPECL SMT Differential Fanout Buffer - TQFP-32
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :TQFP-32 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip SY100EP111UTG-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change: Qualification of MTAI as a new assembly site for selected SY100EP111, SY100EP195V, SY100EP196, SY89295U and SY89296 device families available in 32L TQFP (7x7x1.0mm) package.Reason for Change: To improve manufacturability by qualifying MTAI as a new assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: August 19,2024 (date code: 2434)
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SY100EP111UTG-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--logic--timing-solutions--high-bandwidth/sy100ep111utg-tr-microchip-4988655
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SY100EP111UTG-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--logic--timing-solutions--high-bandwidth/sy100ep111utg-tr-microchip-4988655
Microchip SY100EP111UTG-TR - Caractéristiques techniques
| Temperature Range: | -40°C to +85°C |
| Supply Voltage-Nom: | 2.375V to 3.8V |
| Frequency-Max: | 3GHz |
| Style d'emballage : | TQFP-32 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The SY100EP111UTG is a 3 GHz High-speed, low skew 1-to-10 differential fan out buffer. Its Operating temperature ranges from -40 °C to 85 °C and its available in TQFP-32 package.
Wafer characterization and process contol ensure consistent distribution of propogation delay.
Features:
- 2.5 V and 3.3 V power supply options
- Guaranteed AC parameters over temperature:
- fMAX = 3 GHz
- <25 ps output-to-output skew
- <250 ps tr/tf
- <400 ps propagation delay
- Wide temperature range: –40 °C to +85 °C
- Differential design
- VBB output for single-ended input applications
- Fully compatible with industry standard 100k I/O levels
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
TQFP-32
Méthode de montage :
Surface Mount
