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Référence fabricant
24LC1025T-I/SM
24LC1025 Series 1 Mb I2C 2 Wire (128 K X 8) 2.5 V Serial EEPROM SMT - SOIJ-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :2100 par Reel Style d'emballage :SOIJ-8 Méthode de montage :Surface Mount |
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| Code de date: | 2551 | ||||||||||
Microchip 24LC1025T-I/SM - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Revision History:October 18, 2023: Issued initial notification.November 07, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 15, 2023.December 4, 2023: Re-issued final notification to update and include the Package qual in the Qualification report.Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.
Revision History:October 18, 2023: Issued initial notification.November 07, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 15, 2023.Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.
PCN Status:Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Pre and Post Change Summary: See attachedChange ImpactNoneReason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=24LC1025T-I/SM&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/24lc1025t-i-sm-microchip-7567167
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=24LC1025T-I/SM&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/24lc1025t-i-sm-microchip-7567167
Microchip 24LC1025T-I/SM - Caractéristiques techniques
| Memory Density: | 1Mb |
| Memory Organization: | 128 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | SOIJ-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
It has been developed for advanced, low-power applications such as personal communications or data acquisition.
Features:
- Low-Power CMOS Technology:
- Read current 450 µA, maximum
- Standby current 5 µA, maximum
- 2-Wire Serial Interface, I2C™ Compatible
- Cascadable up to Four Devices
- Schmitt Trigger Inputs for Noise Suppression
- Output Slope Control to Eliminate Ground Bounce
- 100 kHz and 400 kHz Clock Compatibility
- 1 MHz Clock for FC Versions
- Page Write Time 3 ms, typical
- Self-Timed Erase/Write Cycle
- 128-Byte Page Write Buffer
- Hardware Write-Protect
- ESD Protection >400V
- More than 1 Million Erase/Write Cycles
- Data Retention >200 Years
- Factory Programming Available
- Packages include 8-lead PDIP, SOIJ and SOIC
- Pb-Free and RoHS Compliant
- Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Emballages disponibles
Qté d'emballage(s) :
2100 par Reel
Style d'emballage :
SOIJ-8
Méthode de montage :
Surface Mount