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24LC32A-I/MS
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100 per Tube
MSOP-8
Surface Mount
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Product Category: MemoryNotification Subject: CCB 7788.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 24CS64, 24CS32, 24AA64, 24FC64, 24LC32AF, 24LC64, 24AA32AF, 24LC32A, 24AA32A, 24AA64F, 24LC64F, 24FC64F, 24LC128, 24FC128, 24AA128, 24CS128, 24CS256, 24LC256, 24AA256, 24FC256, 24CS512, 24CSM01 and 25CSM01 device families available in 8L MSOP (3x3mm) package at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 24CS64, 24CS32, 24AA64, 24FC64, 24LC32AF, 24LC64, 24AA32AF, 24LC32A, 24AA32A, 24AA64F, 24LC64F, 24FC64F, 24LC128, 24FC128, 24AA128, 24CS128, 24CS256, 24LC256, 24AA256, 24FC256, 24CS512, 24CSM01 and 25CSM01 device families available in 8L MSOP (3x3mm) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 14 September 2026 (date code: 2638)
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Microchip has released a new Datasheet for the 24AA32A/24LC32A - 32-Kbit I2C Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 24AA32A/24LC32A - 32-Kbit I2C Serial EEPROM Data Sheet.Notification Status: FinalDescription of Change: Corrected package offerings in the ?Automotive Product Identification System? section; Minor formatting changes.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 23 Nov 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
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The 24LC32A (24XX32A*) series of 32 Kbit Electrically Erasable PROM is organized as a single block of 4 K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7 V, with standby and active currents of only 1 μA and 1 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition.
The 24XX32A also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 256 Kbits address space. The 24XX32A is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages.
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