Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
24LC64T-I/OT
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
3000 par Reel
SOT-23-5 (SOT-25)
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Product Category: MemoryNotification Subject: CCB 7789.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA32A, 24AA32AF, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS64, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC256, 24FC64, 24FC64F, 24LC32A, 24LC32AF, 24LC64, 24LC64F, AT24C32 and AT24C32E device families available in 5L SOT-23 package at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA32A, 24AA32AF, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS64, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC256, 24FC64, 24FC64F, 24LC32A, 24LC32AF, 24LC64, 24LC64F, AT24C32 and AT24C32E device families available in 5L SOT-23 package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material.Change Implementation Status: In ProgressEstimated First Ship Date: 23 September 2026 (date code: 2639)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change:1. Updated TABLE 1-1: DC CHARACTERISTICS.2. Editorial updates throughout document.Reason for Change: To improve productivity.
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:August 20, 2024 (date code: 2434)
Statut du produit:
It has been developed for advanced, lowpower applications.
Features:
Applications:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.