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Référence fabricant
AT24C256C-MAHL-T
AT24C256C Series 256 Kb (32 K x 8) I2C-Compatible (2-Wire) Serial EEPROM-UDFN-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :UDFN-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip AT24C256C-MAHL-T - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:May 29, 2023: Issued initial notification.August 13, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 7, 2023.February 15, 2024: Re-issued to correct the Pre-change site from ANAP to ATP7Description of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying ATP7 as an additional test location.
Revision History:May 29, 2023: Issued initial notification.August 13, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 7, 2023.Description of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional test location.
PCN Status:Initial NotificationDescription of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional test location.Estimated Qualification Completion Date:June 2023
Microchip has released a new Datasheet for the AT24C256C I?C-Compatible (Two-Wire) Serial EEPROM 256-Kbit (32,768 x 8) Data Sheet of devices. Notification Status: FinalDescription of Change: Updated VFBGA and SOIC package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 Sep 2022
Description of Change:Qualification of 66.88K wafer technology for AT24C256C-XHL-B, AT24C256C-XHL-T, AT24C256C-SSHL-B, AT24C256C-SSHL-T, AT24C256C-MAHL-T and AT24C256C-MAHL-E catalog part numbers (CPN) available in 8L TSSOP (4.4mm), 8L SOIC (3.90mm) and 8L UDFN (2x3x0.6mm) packages at UMC Fab 8D fabrication site.Reason for Change:To improve manufacturability by qualifying 66.88K wafer technology at UMC Fab 8D fabrication site.
Microchip has released a new Datasheet for the AT24C256C I?C-Compatible (Two-Wire) Serial EEPROM 256-Kbit (32,768 x 8) of devices.Description of Change:1) Updated section content throughout for clarification. Added note to Table 4-6 that explains the array architecture and howendurance is specified. Updated Part Marking information. Updated the SOIC, TSSOP and UDFN package drawings.Reason for Change: To Improve Productivity
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of C7025 as an additional lead frame material for selected ATTINY9xx, ATTINY5xx, ATTINY4xx, ATTINY1xx, AT42QT1xx, AT34C02xx, AT30TSxx, AT25xx and AT24Cxx device families available in 8L UDFN (2x2x0.6mm and 2x3x0.6mm) package.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability and productivity by qualifying C7025 as an additional lead frame material.Change Implementation Status:In ProgressEstimated First Ship Date:May 15, 2022 (date code: 2221)
Statut du produit:
Microchip AT24C256C-MAHL-T - Caractéristiques techniques
| Memory Density: | 256kb |
| Memory Organization: | 32 K x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Supply Current: | 2mA |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 100 yr |
| Interface Type: | I2C |
| Access Time-Max: | 450ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Style d'emballage : | UDFN-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
UDFN-8
Méthode de montage :
Surface Mount