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Référence fabricant
AT24C256C-XHL-T
AT24C256C Series 256 Kb (32 K x 8) 1.7 V I2C-Compatible Serial EEPROM - TSSOP-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :TSSOP-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2449 | ||||||||||
Microchip AT24C256C-XHL-T - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: This qualification was originally performed to qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change: Microchip has decided to not qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.
***FPCN110207 UPDATE***Revision History:May 22, 2023: Issued initial notification.July 01, 2024: Issued final notification. Attached the Qualification Report. Updated the pre and post change summary table to include Lead frame design information. Provided estimated first ship date to be on July 22, 2024.November 29, 2024: Re-issued final notification to reflect wire material Au in ANAP and ASSH assembly sites in the Pre and Post Change Summary.January 15, 2025: Re-issued final notification to reflect mold compound CEL-8240HF10P material in ANAP assembly site in the Pre and Post Change Summary. January 23, 2025: Re-issued the final notification to revise the comparison PDF file and reflect the mold compound CEL-8240HF10P material in ANAP assembly site.Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
***July 01, 2024: Issued final notification. Attached the Qualification Report***Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Microchip has released a new Datasheet for the AT24C256C I?C-Compatible (Two-Wire) Serial EEPROM 256-Kbit (32,768 x 8) Data Sheet of devices. Notification Status: FinalDescription of Change: Updated VFBGA and SOIC package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 Sep 2022
Description of Change:Qualification of 66.88K wafer technology for AT24C256C-XHL-B, AT24C256C-XHL-T, AT24C256C-SSHL-B, AT24C256C-SSHL-T, AT24C256C-MAHL-T and AT24C256C-MAHL-E catalog part numbers (CPN) available in 8L TSSOP (4.4mm), 8L SOIC (3.90mm) and 8L UDFN (2x3x0.6mm) packages at UMC Fab 8D fabrication site.Reason for Change:To improve manufacturability by qualifying 66.88K wafer technology at UMC Fab 8D fabrication site.
Microchip has released a new Datasheet for the AT24C256C I?C-Compatible (Two-Wire) Serial EEPROM 256-Kbit (32,768 x 8) of devices.Description of Change:1) Updated section content throughout for clarification. Added note to Table 4-6 that explains the array architecture and howendurance is specified. Updated Part Marking information. Updated the SOIC, TSSOP and UDFN package drawings.Reason for Change: To Improve Productivity
Statut du produit:
Microchip AT24C256C-XHL-T - Caractéristiques techniques
| Memory Density: | 256kb |
| Memory Organization: | 32 K x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Supply Current: | 2mA |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 40 yr |
| Interface Type: | I2C |
| Access Time-Max: | 550ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Style d'emballage : | TSSOP-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount