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AT24CM01-SSHM-T
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4000 per Reel
MSOIC-8
Surface Mount
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PCN Information:
*** Update of FPCN 124320 ***Revision History: September 15, 2026: Issued initial notification.September 25, 2026: Re-issued initial notification to remove wire sweep test from the Qual Plan.Product Category: MemoryDescription of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32D, AT24C32E, AT24C512C, AT24C64B, AT24C64D, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) package at MTAI assembly site.Pre and Post Summary Changes:See attached SPCN for more detailsReason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Product Category: MemoryDescription of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32D, AT24C32E, AT24C512C, AT24C64B, AT24C64D, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Product Category: 8-Bit Microcontrollers, MemoryNotification Subject: CCB 8431.001 Initial Notice: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx,93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, 93C76Cxx, 93C86Cxx, AT93C8xx, 24LC02xx, 24LC01xx, 24AA01xx, 24AA02xx, AT24C0xx, 24AA04xx, ATtinyxx, AT25M0xx, AT24C5xx,AT24CMxx,25LC25xx,25AA25xxNote: See attached SPCN document for more detailed description Description of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx, 93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, Note: See attached SPCN document for more detailed description Reason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
Product Category: MemoryNotification Subject: CCB 8400 Initial Notice: Qualification of MMT as an additional assembly site for selected 24AA102x, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC102x, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC102x, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32x, AT24C512C, AT24C64x, AT24CM01 and AT25M01 device families available in 8L SOIC (3.90mm) packageDescription of Change: Qualification of MMT as an additional assembly site for selected 24AA102x, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC102x, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC102x, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32x, AT24C512C, AT24C64x, AT24CM01 and AT25M01 device families available in 8L SOIC (3.90mm) package.Pre and Post Summary Changes:Pre ChangeMicrochip Technology Thailand (HQ)(MTAI)Post ChangeMicrochip Technology Thailand (HQ)(MTAI)Note: See attached SPCN document for more detailed descriptionReason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Description of Change: Qualification of MMT as an additional assembly site for selected AT24C32E, AT24C64D, 24CS32, 24CS64, AT24C32D, 24AA64, 24FC64, 24AA32AF, 24LC64, 24LC32AF, 24LC32A, AT24C64B, 24AA32A, 24AA64F, 24LC64F, 24FC64F, AT24C128C, 24LC128, 24FC128, 24AA128, 24CS128, 24AA256, AT24C256C, 24LC256, 24CS256, 24FC256, AT24CM01, 24FC1025, 24LC1025, 24LC1026, 24AA1025, 24FC1026, 24AA1026, 24CSM01, 24CW640, 24CW320, 24CW160 and 24CW1280 device families, qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AT24C512C, 24AA512, 24LC512, 24FC512 and 24CS512 device families at MMT assembly site available in 8L SOIC (3.90mm) package.Reason for Change: To improve on-time delivery performance and manufacturability by qualifying MMT as an additional assembly site, palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated First Ship Date: 26 May 2026 (date code: 2622)
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Microchip has released a new Datasheet for the AT24CM01 - 1-Mbit I?C Serial EEPROM, Industrial Grade of devices. Description of Change:Updated date code format on Package Marking Information page; Updated title; Removed typical column in DC Characteristics table; Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Minor editorial updates throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
Revision History:May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.January 30, 2024: Re-issued final notification to update Pre and Post Change Summary.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 26, 2024 (date code: 2404)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:\May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.