
Référence fabricant
AT24CM01-XHM-T
AT24CM01 Series 1 Mb (128 K x 8) I2C-Compatible (2-wire) Serial EEPROM - TSSOP-8
Microchip AT24CM01-XHM-T - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: This qualification was originally performed to qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change: Microchip has decided to not qualify MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.
***FPCN110207 UPDATE***Revision History:May 22, 2023: Issued initial notification.July 01, 2024: Issued final notification. Attached the Qualification Report. Updated the pre and post change summary table to include Lead frame design information. Provided estimated first ship date to be on July 22, 2024.November 29, 2024: Re-issued final notification to reflect wire material Au in ANAP and ASSH assembly sites in the Pre and Post Change Summary.January 15, 2025: Re-issued final notification to reflect mold compound CEL-8240HF10P material in ANAP assembly site in the Pre and Post Change Summary. January 23, 2025: Re-issued the final notification to revise the comparison PDF file and reflect the mold compound CEL-8240HF10P material in ANAP assembly site.Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Microchip has released a new Datasheet for the AT24CM01 - 1-Mbit I?C Serial EEPROM, Industrial Grade of devices. Description of Change:Updated date code format on Package Marking Information page; Updated title; Removed typical column in DC Characteristics table; Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Minor editorial updates throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
***July 01, 2024: Issued final notification. Attached the Qualification Report***Description of Change:Qualification of MMT as an additional assembly site for selected AT24Cxx device family available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT an additional assembly site for AT24CM01-XHM-B, AT24CM01-XHD-B, AT24CM01-XHM-T, and AT24CM01-XHD-T catalog part numbers (CPN) available in 8L TSSOP (4.4mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on time delivery performance by qualifying MMT as an additional assembly location.Change Implementation Status:In ProgressEstimated First Ship Date:March 1, 2024 (date code: 2409)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: see attached
Revision History:October 18, 2023: Issued initial notification.November 07, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 15, 2023.December 4, 2023: Re-issued final notification to update and include the Package qual in the Qualification report.Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.
Revision History:October 18, 2023: Issued initial notification.November 07, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 15, 2023.Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.
Statut du produit:
Microchip AT24CM01-XHM-T - Caractéristiques techniques
Memory Density: | 1Mb |
Memory Organization: | 128 K x 8 |
Supply Voltage-Nom: | 1.7V to 5.5V |
Clock Frequency-Max: | 1MHz |
Write Cycle Time-Max (tWC): | 5ms |
Style d'emballage : | TSSOP-8 |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount