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Référence fabricant
DSPIC33CDV128MP206-E/M9
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40 par Tube
VGQFN-64
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update of DPCN 109558 ***February 19, 2026: Issued final notification. Provided estimated first ship date to be on February 27, 2026. Added column "Change (Yes/No)" in the pre and post change table. Description of Change: Qualification of CVB715BUA as a new mold compound material for selected dsPIC33CDVC256MP506and dsPIC33CDVC128MP506 device families available in 64L VGQFN (9x9x0.927) package.Reason for Change: To improve manufacturability by qualifying CVB715BUA as a new molding compound material.Estimated Qualification Completion Date: 31 March 2026Estimated First Ship Date: 27 February 2026 (date code: 2609)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Microchip has released a new Document for the dsPIC33CDV(C)XXXMP506 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at (C)XXXMP506 Family Silicon Errata and Data Sheet Clarification.Description of Change:Added data sheet clarifications 2. through 17.
Statut du produit:
Sur commande
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
Microchip's dsPIC® DSC-based integrated motor drivers incorporate...
