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Référence fabricant
ATSAMD20J18A-AU
SAMD20J Series 48 MHz 256 kB Flash 32 kB SRAM 32-Bit Microcontroller - TQFP-64
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :160 par Tray Style d'emballage :TQFP-64 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2503 | ||||||||||
Microchip ATSAMD20J18A-AU - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
UPDATE TO Future PCN 116118 and PCN 116159.Revision History: September 22, 2025: Issued final notification.September 23, 2025: Re-issued final notification to correct the Post Change for wire material to be Au and CuPdAu on the Pre and Post Change Summary table.October 01, 2025: Re-issued final notification to correct the Post Change wire material on the Pre and Post Change Summary table and align with the updated Qual Report attachment.Description of Change: Qualification of CuPdAu as an additional wire material for selected ATSAMD20J17, ATSAMC20J15A, ATSAMC20J16A, ATSAMC20J17A, ATSAMC20J18A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD20J14, ATSAMD20J15, ATSAMD20J16, ATSAMD20J18, ATSAMD21J15, ATSAMD21J16, ATSAMD21J17, ATSAMD21J18, ATSAMDA1J14B, ATSAMDA1J15B, ATSAMDA1J16B, PIC32CM1602GV00064, PIC32CM2532JH00064, PIC32CM2532JH01064, PIC32CM2532LE00064, PIC32CM2532LS00064, PIC32CM3204GV00064, PIC32CM3204JH00064, PIC32CM5164JH00064, PIC32CM5164JH01064, PIC32CM5164LE00064, PIC32CM5164LS00064 and PIC32CM6408JH00064 device families available in 64L TQFP (10x10x1mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional wire material.
***UPDATE OF PCN116118***Description of Change: Qualification of CuPdAu as an additional wire material for selected ATSAMD20J17, ATSAMC20J15A, ATSAMC20J16A, ATSAMC20J17A, ATSAMC20J18A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD20J14, ATSAMD20J15, ATSAMD20J16, ATSAMD20J18, ATSAMD21J15, ATSAMD21J16, ATSAMD21J17, ATSAMD21J18, ATSAMDA1J14B, ATSAMDA1J15B, ATSAMDA1J16B, PIC32CM1602GV00064, PIC32CM2532JH00064, PIC32CM2532JH01064, PIC32CM2532LE00064, PIC32CM2532LS00064, PIC32CM3204GV00064, PIC32CM3204JH00064, PIC32CM5164JH00064, PIC32CM5164JH01064, PIC32CM5164LE00064, PIC32CM5164LS00064 and PIC32CM6408JH00064 device families available in 64L TQFP (10x10x1mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional wire material.Estimated First Ship Date: 13 November 2025 (date code: 2546)
Description of Change: Qualification of CuPdAu as an additional wire material for selected ATSAMD20J17, ATSAMC20J15A, ATSAMC20J16A, ATSAMC20J17A, ATSAMC20J18A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD20J14, ATSAMD20J15, ATSAMD20J16, ATSAMD20J18, ATSAMD21J15, ATSAMD21J16, ATSAMD21J17, ATSAMD21J18, ATSAMDA1J14B, ATSAMDA1J15B, ATSAMDA1J16B, PIC32CM1602GV00064, PIC32CM2532JH00064, PIC32CM2532JH01064, PIC32CM2532LE00064, PIC32CM2532LS00064, PIC32CM3204GV00064, PIC32CM3204JH00064, PIC32CM5164JH00064, PIC32CM5164JH01064, PIC32CM5164LE00064, PIC32CM5164LS00064 and PIC32CM6408JH00064 device families available in 64L TQFP (10x10x1mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional wire material.Estimated First Ship Date: 13 November 2025 (date code: 2546)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Updated the entire document to reflect new silicon revision H. Removed obsolete clarifications from Data Sheet ClarificationsAdded the following Errata:? Device: 1.5.22 One-Time Programmable Lock? SERCOM: 1.15.5 SERCOM I2C Client SDAHOLDReason for Change: To Improve Productivity
Microchip has released a new Datasheet for the SAM D20 Family Data Sheet of devices. Notification Status: FinalDescription of Change:SectionDescriptionPower Manager? Removed erroneous Clock Failure Detection content from the Overview? Removed erroneous Clock Failure Detection content from the Features? Updated Figure 15-2 in Selecting the Synchronous Clock Division Ratio? Removed erroneous Clock Failure Detection content from the Interrupts? Removed erroneous Clock Failure Detection content from the following registers:? CTRL? INTENCLR? INTENSET? INTFLAGSYSCTRL? Added a note to BOD33RDY in the PCLKSR Register? Removed erroneous Standby Sleep Mode from the ONDEMAND bitfield of the DFLLCTRL RegisterNVMCTRL? Added a new bullet of information to Procedure for Manual Page Writes (CTRLB.MANW=1)PORT - I/O? Updated the PINCFG Register Reset PropertyAC? Added a note to Offset CompensationSchematic Checklist? Removed an erroneous image from External Reset Circuit? Updated the MHz value in Table 36-5Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 03 Jan 2025
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=ATSAMD20J18A-AU&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--32-bit/atsamd20j18a-au-microchip-2038947
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=ATSAMD20J18A-AU&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--32-bit/atsamd20j18a-au-microchip-2038947
Microchip ATSAMD20J18A-AU - Caractéristiques techniques
| Family Name: | SAMD20 |
| Core Processor: | ARM Cortex M0+ |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 32kB |
| Speed: | 48MHz |
| No of I/O Lines: | 52 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/Reset/Watchdog |
| Supply Voltage: | 1.62V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 20-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | TQFP-64 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
160 par Tray
Style d'emballage :
TQFP-64
Méthode de montage :
Surface Mount
