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Référence fabricant
PIC32CX1025SG41100-I/E5X
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
90 par Tray
TQFP-100
Surface Mount
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Code HTS:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Datasheet for the PIC32CX SG41/SG60/SG61 Family Data Sheet of devices. Notification Status: FinalDescription of Change:Revison JThe following updates were performed in this revision:Section Description1-MB Flash, 256-KB SRAMwith optional Hardware SecurityModule, Crypto, 1 MSPS 12-bitADC, QSPI, USB, Ethernet, andPTC? Added VDDIOB information to Operating ConditionsPinout and Packaging? Updated the following Pinout tables with new VDDIOB information for the PIC32CXSG41:? 64-Pin TQFP? 80-Pin WLCSP? 100-Pin TFBGA and 100-Pin TQFP? 128-pin TQFPDevice Start-Up? Added VDDIOB content to Power-Up ConsiderationsElectrical Specifications 85?C? Added VDDIOB information to table 55-2 in General Operating Ratings and ThermalConditions? Added VDDIOB information to REG_43, REG_44, and a new Entry for REG_54 to PowerSupply, along with the addition of supporting notesSchematic Checklist? Added VDDIOB information to the Bulk capacitors description in Decoupling Capacitors? Updated all images in Power Supply Connections to reflect the addition of VDDIOBinformation? Updated the table in Power Supply Connections to include a row for VDDIOB, and newnotesImpacts to Data Sheet: See above detailsReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 21 Jul 2025
Description of Change:The following updates were performed in this revision:1. 1-MB Flash, 256-KB SRAM with optional Hardware Security Module, Crypto, 1 MSPS 12-bit ADC, QSPI, USB, Ethernet, and PTC ? Updated Table 1 with new 80-pin WLCSP information2. Configuration Summary ? Updated Table 1-1 with 80-pin WLCSP information3. Pinout and Packaging ? Added a new Pinout for the 80-pin WLCSP Package4. Packaging Information ? Added a new 80-pin WLCSP Package DrawingsReason for Change: To improve productivity.
Microchip has released a new Errata for the PIC32CX SG41/SG60/SG61 Family Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change: The following errata were added in this revision: ? Device: 2.3.2 Power UpImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 23 February 2023
Microchip has released a new Datasheet for the PIC32CX SG41/SG60/SG61 Family Data Sheet of devices. Notification Status: FinalReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 15 Feb 2023
Microchip has released a new Errata for the PIC32CX SG41/SG60/SG61 Family Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change: The following errata were added in this revision:? SERCOM USART: 2.9.4 LIN Host Delays? SERCOM USART: 2.9.5 Two Stop Bits Mode in LIN HostUpdated the verbiage in the following errata:? TCC: 2.10.1 Auto Lock Feature? Device: 4.3.1 Detection of a Debugger ProbeImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 31 Jan 2023
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
