Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
PIC16F15323-I/SL
Download the CAD models for this product. Learn more about SnapMagic.
57 per Tube
SOIC-14
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update of FPCN 99831 ***Revision History: Issued final notification. 3/10/2026 - Corrected the initial issuance from year 2022 to 2023. Updated the die attach in Post change table from "8390A to QMI519". Updated the Dap Surface Prep in Post change table to add "Selective Ag Plating". Revised the notification subject to reflect the updated affected parts list. Updated the affected parts list to include AVR16DD14-I/SL, AVR32DD14E/SL, AVR32DD14-I/SL, AVR16DD14-E/SL, AVR16DD14T-E/SL, AVR32DD14TI/SL, AVR32DD14T-E/SL, AVR16DD14T-I/SL, PIC18F06Q20-E/SL, PIC18F06Q20TI/SL, PIC18F06Q20-I/SL, AVR16DU14-I/SL, AVR16DU14T-I/SL, AVR32DU14TI/SL, AVR32DU14-I/SL, PIC18F04Q20-E/SL, PIC18F05Q20-I/SL, PIC18F04Q20I/SL, PIC18F05Q20-E/SL, PIC18F05Q20T-I/SL, PIC18F04Q20T-I/SL, PIC16F15323TE/SL, PIC16F15313T-I/SN020 catalog part numbers and to remove the EOL'd CPN PIC16F15313TI/SN021. Added the "Change (Yes/No) column to the Pre- and Post- Change Summary table. Attached the Qualification Report. Provided the estimated first ship date to be on April 03, 2026.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected product device families listed on the SPCN attachment are available in 14L and 8L SOIC (3.90mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated First Ship Date: 03 April 2026 (date code: 2614)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
PCN Status:Cancellation NotificationReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.
Microchip has released a new Errata for the PIC16(L)F15313/23 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC16(L)F15313/23 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Updated data sheet revision to revision E. Removed Data Sheet Clarifications for previous revision.Impacts to Data Sheet: NoneReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 10 Aug 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
PCN Status: Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF153xx, PIC16LF183xx, PIC16LF184xx, PIC18F04Q4xx, PIC18F05Q4xx and PIC18F06Q4xx device families available in 14L and 8L SOIC (3.90mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
