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Manufacturer Part #
PIC18F06Q20-I/SL
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57 per Tube
SOIC-14
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update of FPCN 99831 ***Revision History: Issued final notification. 3/10/2026 - Corrected the initial issuance from year 2022 to 2023. Updated the die attach in Post change table from "8390A to QMI519". Updated the Dap Surface Prep in Post change table to add "Selective Ag Plating". Revised the notification subject to reflect the updated affected parts list. Updated the affected parts list to include AVR16DD14-I/SL, AVR32DD14E/SL, AVR32DD14-I/SL, AVR16DD14-E/SL, AVR16DD14T-E/SL, AVR32DD14TI/SL, AVR32DD14T-E/SL, AVR16DD14T-I/SL, PIC18F06Q20-E/SL, PIC18F06Q20TI/SL, PIC18F06Q20-I/SL, AVR16DU14-I/SL, AVR16DU14T-I/SL, AVR32DU14TI/SL, AVR32DU14-I/SL, PIC18F04Q20-E/SL, PIC18F05Q20-I/SL, PIC18F04Q20I/SL, PIC18F05Q20-E/SL, PIC18F05Q20T-I/SL, PIC18F04Q20T-I/SL, PIC16F15323TE/SL, PIC16F15313T-I/SN020 catalog part numbers and to remove the EOL'd CPN PIC16F15313TI/SN021. Added the "Change (Yes/No) column to the Pre- and Post- Change Summary table. Attached the Qualification Report. Provided the estimated first ship date to be on April 03, 2026.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected product device families listed on the SPCN attachment are available in 14L and 8L SOIC (3.90mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated First Ship Date: 03 April 2026 (date code: 2614)
Description of Change:Updated data sheet revision to E; minor grammatical corrections.Reason for Change: To Improve Productivity.Date Document Changes Effective: 03 Oct 2025
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AVR16DD14, AVR32DD14 and PIC18F06Q20 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
