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Référence fabricant
CYUSB3304-68LTXI
HX3 Series 3.6 V 16 kB RAM 4 Port 5 Gbps USB 3.0 Hub Controller IC - QFN-68
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :260 par Tray Style d'emballage :QFN-68 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2519 | ||||||||||
Infineon CYUSB3304-68LTXI - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 109266 /Molding Compound Change ***- Original PCN N? 2024-164-A dated 2024-11-07- Delta to previous revision:- Update of First sample availability data from 2025-02-28 to 2026-03-31.- Update of the Intended start of delivery from 2025-04-15 to 2026-06-30.Subject Change of mold compound from Kyocera KEG3000NASLS, KEG3000DACY to Sumitomo EME G600CE for products from Infineon Technologies Manufacturing Ltd. Philippines Branch.Reason Experienced inconsistency delivery support from existing mold compound supplier - Kyocera. To enable sourcing flexibility and mitigate supply risk, Sumitomo is introduced as an additional mold compound supplier.DescriptionOld:- Kyocera KEG3000NASLS/KEG3000DACYNew- Sumitomo EME G600CE- Kyocera KEG3000NASLS/KEG3000DACY- Time schedule- Final qualification report Available- First samples available 2026-03-31- Intended start of delivery 2026-06-30
Description:Extension of total storage time of Finished Goods to 5 years for SMD (Surface Mount Devices) and WLCSP (Wafer Level Chip-Scale Package) packagesReason Infineon able to improve our Finished Goods storage from 2 years to 5 years without having any impact to quality and performance.Intended start of delivery - 2025-09-30
Description:Change of mold compound from Kyocera KEG3000NASLS, KEG3000DACY to Sumitomo EME G600CE for products fromInfineon Technologies Manufacturing Ltd. Philippines BranchReason:Experienced inconsistency delivery support from existing mold compound supplier - Kyocera. To enable sourcing flexibility and mitigate supply risk, Sumitomo is introduced as an additional mold compound supplier.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=CYUSB3304-68LTXI&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--signal-interface--usb/cyusb3304-68ltxi-infineon-5044088
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=CYUSB3304-68LTXI&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--signal-interface--usb/cyusb3304-68ltxi-infineon-5044088
Infineon CYUSB3304-68LTXI - Caractéristiques techniques
| Data Rate: | 5Gbps |
| Supply Voltage: | 1.14V to 1.26V |
| Operating Temp Range: | -40°C to +85°C |
| Interface/Version: | 3.0 |
| Storage Temperature Range: | -65°C to +150°C |
| Interface Type: | 3-Wire |
| No of Pins: | 68 |
| Supply Current: | 410mA |
| Frequency: | 26MHz |
| No of Ports: | Quad |
| Moisture Sensitivity Level: | 3 |
| Style d'emballage : | QFN-68 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
260 par Tray
Style d'emballage :
QFN-68
Méthode de montage :
Surface Mount