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Référence fabricant
LAN9353I/ML
LAN9353 Series 3.3 V 3-Port 10/100 Managed Ethernet Switch - QFN-64
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :260 par Tray Style d'emballage :QFN-64 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip LAN9353I/ML - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of QMI519 as a new die attach material for selected LAN9353, LAN9250, LAN9252, LAN9253 device families and LAX9252I/ML catalog part number (CPN) available in 64L QFN (9x9x0.9mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach material at MTAI assembly site.Revision History:June 27, 2024: Issued initial notification.December 10, 2024: Issued final notification. Updated affected parts list to add LAX9252I/ML catalog part number. Updated the notification subject and description of change to include CPN LAX9252I/ML. Attached the Qualification Report. Provided estimated first ship date to be on January 10, 2025.December 13, 2024: Re-issued final notification to update time table summary and date code.
PCN Status:Final NotificationDescription of Change:Qualification of QMI519 as a new die attach material for selected LAN9353, LAN9250, LAN9252, LAN9253 device families and LAX9252I/ML catalog part number (CPN) available in 64L QFN (9x9x0.9mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:10 January 2025 (date code: 252)
Description of Change:Qualification of QMI519 as a new die attach material for selected LAN9353, LAN9250, LAN9252, and LAN9253 device families available in 64L QFN (9x9x0.9mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach material at MTAI assembly site.
Microchip has released a new Datasheet for the LAN9353 3-Port 10/100 Managed Ethernet Switch with Single MII/RMII/Turbo MII or Dual RMII of devices. Impacts to Data Sheet: See details attached.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Apr 2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=LAN9353I/ML&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--comm-products--switch/lan9353i-ml-microchip-7101803
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=LAN9353I/ML&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--comm-products--switch/lan9353i-ml-microchip-7101803
Microchip LAN9353I/ML - Caractéristiques techniques
| Data Rate: | 200Mbps |
| Supply Voltage-Nom: | 1.14V to 3.6V |
| Supply Current: | 198mA |
| Duplex: | Half/Full Duplex |
| Power Dissipation: | 1.148W |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -55°C to +150°C |
| No of Functions / Channels: | 2 |
| Interface Type: | MII/RMII/Turbo MII |
| No. of Transceivers: | 2 |
| Protocols Supported: | Ethernet |
| No of Terminals: | 64 |
| Style d'emballage : | QFN-64 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
260 par Tray
Style d'emballage :
QFN-64
Méthode de montage :
Surface Mount