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24AA02T/SN
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3300 per Std. Mfr. Pkg
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for 24FC04, 24LC02BH, 24LC04B, 24FC02, 24LC02B, 24AA01, 24AA02, 24LC01B, 24LC04BH, 24FC04H, 24AA04, 24LC01BH, 24FC01, 24AA04H, 24AA01H, 24AA02H, AT24C08C, AT24C16D, 24AA16H, 24LC16BH, 24FC08, 24LC08B, AT24C16C, 24AA08H, 24AA08, 24AA16, 24LC08BH, 24FC16H, 24FC16, and 24LC16B device families available in 8L SOIC (3.90mm) package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated First Ship Date: 03 June 2026 (date code: 2623)
*** Update for PCN 116117 ***Revision History:October 13, 2025: Re-issued to update the affected CPN listDescription of Change:Microchip has released a new Datasheet for the 24AA02/24LC02B/24FC02 - 2-Kbit I2C Serial EEPROM of devices.Added 4 million E/W cycles for FC devices only; Added Q6B package outline drawing; Minor editorial updates throughout the document.Date Document Changes Effective: 22 Sep 2025
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
Description of Change:Added 4 million E/W cycles for FC devices only; Added Q6B package outline drawing; Minor editorial updates throughout the document.Date Document Changes Effective: 22 Sep 2025
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*** Update for PCN 113340 ***Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach materialRevision History: May 30, 2025: Issued final notificationJune 06, 2025: Re-issued final notification. Updated to Qualification Report Summary in Qual Report attachment.
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach material
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