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Manufacturer Part #
AT24CM01-SHD-B
AT24CM01 Series 1 Mb (128 K x 8) 3.3 / 5 V I2C Serial EEPROM - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:95 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount |
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| Date Code: | 2347 | ||||||||||
Microchip AT24CM01-SHD-B - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Microchip has released a new Datasheet for the AT24CM01 - 1-Mbit I?C Serial EEPROM, Industrial Grade of devices. Description of Change:Updated date code format on Package Marking Information page; Updated title; Removed typical column in DC Characteristics table; Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Minor editorial updates throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
Revision History:October 18, 2023: Issued initial notification.November 07, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 15, 2023.December 4, 2023: Re-issued final notification to update and include the Package qual in the Qualification report.Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.
Revision History:October 18, 2023: Issued initial notification.November 07, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 15, 2023.Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.
PCN Status:Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Pre and Post Change Summary: See attachedChange ImpactNoneReason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change:Qualification of MTAI as an additional assembly site and test location for selected AT25256Bxx, AT24C512xx, AT24CM01xx, and AT25M01xx device families available in 8L SOIJ (.208in) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional assembly site and additional test location.
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24CM01-SHD-B&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24cm01-shd-b-microchip-9107015
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24CM01-SHD-B&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24cm01-shd-b-microchip-9107015
Microchip AT24CM01-SHD-B - Technical Attributes
| Memory Density: | 1Mb |
| Memory Organization: | 128 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
95 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount