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Manufacturer Part #
DF70865AN80FPV
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1 per Tray
LQFP-144
Surface Mount
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****FPCN122502 DOCUMENT UPDATE:LOCATION AND TESTING CHANGE/ FROM PC-MCU-A048A/E TO PC-MCU-A048B/E ****Subject: Transfer of the Final Test, Visual Inspection and Packing production line for MCU products Description of Change: The Final Test, Visual Inspection and Packing production line for the affected MCU products will be transferred from Oita and Yonezawa factory to Tera Probe, INC.Reason for Change: To ensure stable supply and enhance competitiveness, Renesas back-end manufacturing factories are pursuing productivity improvements through process standardization, automation and specialization. As part of this initiative, the production line of the affected MCU products will be transferred to Tera Probe, INC.. Effective Date: 1/15/2027
Subject: Transfer of the Final Test, Visual Inspection and Packing production line for MCU productsDescription of Change: The Final Test, Visual Inspection and Packing production line for the affected MCU products will be transferred from Oita and Yonezawa factory to Tera Probe, INC.Reason for Change: To ensure stable supply and enhance competitiveness, Renesas back-end manufacturing factories are pursuing productivity improvements through process standardization, automation and specialization. As part of this initiative, the production line of the affected MCU products will be transferred to Tera Probe, INC.Effective Date: 1/15/2027
Description of Change:Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.Reason for Change: To secure a stable product supply and environment friendly strengthening (Improvement of efficiency in use of packaging resources, reduction of waste)
The purpose of this notification is to communicate a product change of select Renesas Electronics America, Inc. (REA) devices. This notification announces the addition of full carton part numbers for select MCU & SOC devices. Full carton shipments will be standard and combine a maximum of 3 production lots. See the appendix for additional details. The full carton shipments will have a new part number. There is no impact to the specifications, fit, form, characteristics, quality & reliability of the products.
Subject: MCU/SOC products announcement of Full Carton.Description of Change:Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.