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Manufacturer Part #
PIC16F1828-I/ML
PIC16F Series 7 kB Flash 256 B RAM 32 MHz 32-Bit Microcontroller - QFN-20
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:91 per Tube Package Style:QFN-20 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC16F1828-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of MPHL as an additional final test site for selected PIC16F1619, PIC16F1829, PIC16F1507, PIC16F1508, PIC16F1709, PIC16LF1559, PIC16F18044, PIC16F18045, PIC18F14K22, PIC18F13K22, PIC16F1828, PIC16F1618, PIC16F1509, PIC16F1708, PIC16F721, PIC16F18046, PIC16LF1828, PIC16LF1829 and PIC16F720 device families available in 20L QFN (4x4x0.9mm) package.Pre and Post Summary Changes: See attached documentImpacts to Datasheet: NoneChange Impact: NoneReason for Change:To improve productivity and on-time delivery performance by qualifying MPHL as an additional final test site.Change Implementation Status: In ProgressEstimated First Ship Date:09 August 2025 (date code: 2532)Note: Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Timetable Summary: See attached document
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 16L, 20L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 16L, 20L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.November 06, 2023: Issued initial notification.March 08, 2024: Reissued initial notification. Updated the affected parts list. Updated the mold compound from CEL-400ZHF40-PLM2KG to X8511AU-IMP1 (1st mold) / X8511CUB-AP1 (2nd mold), and EME-QXG01 (1st & 2nd mold), and updated die attach from BSP 140 to BSP 1100 in the pre- and post- change summary table. Updated the estimated qualification completion date to be on March 2024.March 15, 2024: Reissued initial notification to update the Qual Plan file name.April 16, 2024: Issued final notification. Added estimated first ship date on May 01, 2024 and updated qual report completion on May 31, 2024. Updated the affected CPN list to add newly released parts. Updated post change mold compound material to NEPL Proprietary.December 10, 2024: Re-issued final notification. Attached the qualification report. Updated the affected CPN list to add newly released parts. Removed CPNs PIC18F16Q20-I/REBC01 and PIC18F16Q20TI/REBC01 on the affected parts list due to being EOL'd. Removed 16L QFN (4x4x0.9mm) package and included 20L VQFN (4x4x1.0mm) package in the Notification subject.March 12, 2025: Issued cancellation notice.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 16L, 20L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:01 May 2024 (date code: 2418)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Revision History:November 06, 2023: Issued initial notification.March 08, 2024: Reissued initial notification. Updated the affected parts list. Updated the mold compound from CEL-400ZHF40-PLM2KG to X8511AU-IMP1 (1st mold) / X8511CUB-AP1 (2nd mold), and EME-QXG01 (1st & 2nd mold), and updated die attach from BSP 140 to BSP 1100 in the pre- and post- change summary table. Updated the estimated qualification completion date to be on March 2024.March 15, 2024: Reissued initial notification to update the Qual Plan file name.April 16, 2024: Issued final notification. Added estimated first ship date on May 01, 2024 and updated qual report completion on May 31, 2024. Updated the affected CPN list to add newly released parts. Updated post change mold compound material to NEPL Proprietary.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L and 20L QFN (4x4x0.9mm), 16L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L QFN and 20L QFN (4x4x0.9mm), 16L VQFN and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L QFN and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L QFN and 20L QFN (4x4x0.9mm), 16L VQFN and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L QFN and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
Microchip PIC16F1828-I/ML - Technical Attributes
| Family Name: | PIC16F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 7kB |
| RAM Size: | 256B |
| Speed: | 32MHz |
| No of I/O Lines: | 17 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 12-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | QFN-20 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
91 per Tube
Package Style:
QFN-20
Mounting Method:
Surface Mount