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Manufacturer Part #
AT89C51ED2-SLSUM
AT89xx Series 64 KB Flash 2 KB SRAM 60 MHz 8-Bit Microcontroller - PLCC-44
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:27 per Tube Package Style:PLCC-44 Mounting Method:Surface Mount |
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| Date Code: | 2531 | ||||||||||
Microchip AT89C51ED2-SLSUM - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*****FPCN111925 UPDATE*****Description of Change:Qualification of MTAI as a new final test site for selected AT89C51IC2, AT89C51RB2, AT89C51RC2, AT89C51ED2, AT89C51ID2, AT89C51RD2, AT89C51AC3,AT89C51CC03, AT89C51AC2, AT89C51CC01 and AT80C51RD2 device families available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change: To improve manufacturability performance by qualifying MTAI as a new final test site.
Description of Change: Qualification of MTAI as a new final test site for selected AT89C51IC2, AT89C51RB2, AT89C51RC2, AT89C51ED2, AT89C51ID2, AT89C51RD2, AT89C51AC3, AT89C51CC03, AT89C51AC2, AT89C51CC01 and AT80C51RD2 device families available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change: To improve manufacturability performance by qualifying MTAI as a new final test site.Estimated Qualification Completion Date: April 2025
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT89C51ED2-SLSUM&field4=Microchip&field18=https://p1na.futureelectronics.com/p/1038167
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT89C51ED2-SLSUM&field4=Microchip&field18=https://p1na.futureelectronics.com/p/1038167
Microchip AT89C51ED2-SLSUM - Technical Attributes
| Family Name: | AT89C |
| Core Processor: | 80C51 |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 2kB |
| Speed: | 60MHz |
| No of I/O Lines: | 34 |
| InterfaceType / Connectivity: | SPI/UART/USART |
| Peripherals: | POR/PWM/Watchdog |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| Watchdog Timers: | 1 |
| Package Style: | PLCC-44 |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
27 per Tube
Package Style:
PLCC-44
Mounting Method:
Surface Mount